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Home arrow Wafer Processing arrow Articles arrow Edition 15 arrow 15th Edition: Optical Digital Profilometry: A Breakthrough ...
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15th Edition: Optical Digital Profilometry: A Breakthrough Technology for Non-Destructive Profile Print E-mail
Feb 02, 2005 at 04:15 PM
KELLY BARRY, MIKE LAUGHERY, NICKHIL JAKATDAR & WENGE YANG, Timbre Technologies Inc., Fremont, California, CA, USA

ABSTRACT

Optical digital profilometry is an optical technology that provides inline critical dimension, crosssectional profile, and film thickness information on wafers in a single measurement non-destructively. It can be used in most of photolithography and plasma etching process steps for process monitoring, control, development, and fault detection. It provides better CD measurement precision, repeatability, and can be extended to sub-100-nm technologies and beyond.
icon 09 - Optical Digital Profilometry: A Breakthrough Technology for Non-Destructive Inline Profile...

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