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15th Edition: Process Control and Defect Inspection Strategies for 300mm Fabs |
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Feb 02, 2005 at 04:04 PM |
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ANANTHA SETHURAMAN, SAGAR A. KEKARE, RAMAN NURANI & DADI GUDMUNDSSON, KLA-Tencor Inc., San Jose, CA, USA ABSTRACT
The
move to a smaller design rule and the associated processing methods are
automatic by-products of the demand for ever more powerful ICs. As a
result, there are some anticipated yield management challenges.
Coinciding with the most recent IC design rule reduction is the
long-awaited transition to 300 mm processing, which presents several
unique yield management problems not emphasised before. Some of the
process control and defect inspection methodology challenges associated
with the 300 mm transition are summarised, and the fundamentals of
surmounting them are discussed. Key conclusions are the potential
emergence of new defect inspection points and the importance of
including yield management in the fab planning process from the
beginning.
 05 - Process Control and Defect Inspection Strategies for 300mm Fabs
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Wafer Processing 
