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New Product: KLA-Tencor’s new brightfield inspection tool has 2x faster data rate capture |
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Mar 09, 2006 at 04:31 PM |
 Product Briefing Outline: KLA- Tencor has launched its fifth-generation broadband UV/visible brightfield inspection system. The 2367 is claimed to deliver increased sensitivity and a 2x faster data rate to help chipmakers sample more frequently and capture critical layer defects earlier. The system is designed to work with KLA-Tencor's 2800 Series full-spectrum DUV/UV/visible brightfield inspection platform, the 2367 enables a mix-and-match inspection strategy that is claimed to provide the lowest overall cost of inspection for next-generation IC manufacturing. According to the company the 2367 is running in production at several 90-nm and 65-nm fabs worldwide.
Problem: Defect, yield and process engineers face new defect types and noise sources, pattern-limited yield issues, and a rise in systematic defects. Addressing these issues requires increased, high sensitivity sampling of work in progress at critical patterning layers, such as gate etch and copper chemical mechanical planarization (CMP). To help meet these challenges, the 2367 leverages the sensitivity advantages of the 2800 along with industry-leading throughput on UV and visible layers.
Solution: Sophisticated algorithms from the 2800 are integrated into the 2367 to increase its sensitivity. For example, advanced binning and classification, enhanced edge contrast, and multi-die auto threshold equip the tool to find increasingly smaller critical defect types on all layers. The 2367 also features a new image computer and breakthrough time delay integration (TDI) sensor that enable the market's fastest data rate for tighter, faster process control. Its selectable broadband illumination modes and high numerical aperture deliver improved resolution and material contrast for detection of smaller defect types on resolution-limited layers, while at the same time providing lower false defect counts. The tool also can quickly segment critical defects from nuisance defects.
Applications: Critical patterning layers, such as gate etch and copper chemical mechanical planarization.
Platform: The 2367 shares a user interface and recipe commonality with several other KLA-Tencor inspection and review platforms, including the 2800, the Puma 9000 darkfield inspector, and the eS32 e-beam inspection tool. These commonalities enable engineers to leverage multiple inspection tools at the lowest overall cost to drive yield ramps.
Availability: March 2006 onwards.
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Product Briefings 
