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15th Edition: The Future Direction of CMP Consumables |
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Feb 02, 2005 at 03:50 PM |
MARIA PETERSON & KATHLEEN PERRY, Cabot Microelectronics Corporation, Aurora, IL, USA
ABSTRACT
Device shrinks continue to drive more stringent performance
requirements for every step of IC manufacturing. Increased numbers of
metal layers and smaller critical dimensions demand even more planar
surfaces than were previously acceptable. New materials being
introduced - low-k dielectrics, high-k dielectrics, noble metals -
require creative chemical and mechanical approaches to planarisation
that enable multiple integration strategies.
 01 - The Future Direction of CMP Consumables
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Wafer Processing 
