Online information source for semiconductor professionals
Real-time profile control: advanced process control for copper CMP
Popular articles
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008
Micron close to Inotera share purchase, says Gartner - 06 October 2008
Applied Materials sees higher CapEx spending for 2009 - 15 August 2008
Doyle Bennett, Jimin Zhang, Bogdan Swedek, Jeff David & Manush Birang, Applied Materials, CMP Division, Sunnyvale, CA, USA & Dick de Roover, SC Solutions, Sunnyvale, CA, USA
ABSTRACT
Real-time profile control (RTPC™) has been implemented for 300-mm copper CMP via closed-loop control of bulk copper removal, on a withinwafer (WIW) basis. The method uses a high-resolution sensor to measure the copper thickness across the wafer during polishing (in situ). The bulk copper-removal process is controlled via incremental changes to polishing conditions in situ, real-time using a multi-zone polishing head, the Titan Profiler™. The RTPC system has demonstrated more uniform copper clearing, which provides lower and more consistent WIW copper loss than is possible with an open-loop process (i.e., fixed conditions).
Real-time profile control: advanced process control for copper CMP.
 |
Please login to download the paper. No account yet? Please register. It's free! |