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New Product: KLA-Tencor boost productivity on optical CD metrology system |
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Feb 08, 2006 at 06:28 PM |
Product Briefing Outline: KLA-Tencor has launched its latest-generation
optical CD metrology system, the SpectraCD-XT, which provides inline CD
and profile measurements of critical device structures that help enable
early prediction of IC performance and yield at the 90-nm and 65-nm
nodes. The only high-performance spectroscopic ellipsometry (SE)-based
CD metrology tool with sub-two-second move-acquire-measure (MAM) time,
SpectraCD-XT provides a two-fold increase in throughput (to more than
100 wph) compared to the previous-generation platform at comparable
performance, according to the company.
Problem: Chipmakers face shrinking process windows and tighter process
tolerances as they scale to smaller design rules. As a result, minute
lithography process variations can significantly impact device
performance and functional yields. This drives the need for increased
measurement sampling early in the manufacturing cycle with minimal
impact to fab productivity. In addition to requiring standard CD
linewidth information, increasing hidden systematic errors in
lithography today mandate the need for 3D profile information on device
structures, including sidewall angle, and top and bottom CD, to obtain
yield-relevant data that provides better correlation to
back-end-of-line (BEOL) device performance tests.
Solution: SpectraCD-XT with SE technology offers leading precision on
advanced applications where device structures are highly complex and
require multiple types of measurements, such as shallow trench
isolation (STI), gate and spacer. Unlike reflectometry-based metrology
systems, which provide near-normal incidence (top-down) illumination,
KLA-Tencor's SE optics uses oblique illumination to enable the
identification of smaller structural anomalies-such as notching and
footing of gate profiles-that more accurately correlate to end-of-line
device performance and yield. Emerging optical CD metrology
applications include: contact holes; BEOL trenches and vias; and
scanner qualification, where the SpectraCD-XT's sub-two-second MAM time
makes it an ideal solution for measuring the tens of thousands of points per wafer
needed to characterize cross-field and cross-wafer CD uniformity.
As CD process control budgets shrink, tool matching has become
increasingly critical for device manufacturability. The SpectraCD-XT
offers excellent matching performance, both tool-to-tool and with
KLA-Tencor's integrated CD module, enabling chipmakers to implement a
comprehensive fab-wide CD control strategy. Improved model setup and
analysis tools embedded on the SpectraCD-XT speeds library generation
by 30 to 60x-providing significant savings in time and engineering
resources, which in turn, help enable faster yield learning on new
technologies. The system is also built on a platform with proven
reliability in high-volume production.
Applications: Shallow trench isolation (STI), gate and spacer.
Platform: The system is built on a platform with proven reliability in
high-volume production. Improved model setup and analysis tools
embedded on the SpectraCD-XT speeds library generation by 30 to 60x.
Availability: February 2006 onwards
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Product Briefings 
