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Tool Orders: FSI International’s PlatNiStrip process in Zeta tool selected for 65nm production |
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Feb 07, 2006 at 08:07 PM |
 Several of the largest IC manufacturers have selected FSI
International's PlatNiStrip process for advanced salicide formation, on
the Zeta platform, according to the company.
FSI's PlatNiStrip process, a point-of-use blended acid solution, can
strip both nickel and platinum without residues and with high
selectivity to silicide, oxide and nitride, which enables the
integration of nickel-platinum silicide.
"A key customer stated they were impressed with our ability to quickly
implement the process into their manufacturing line, and as a result
they are now using this nickel-platinum strip process to produce 65nm
products," said Don Mitchell, FSI chairman and CEO.
The ZETA system is designed for FEOL and BEOL 90nm and below, 200/300mm
batch spray cleaning. The system uses centrifugal spray combined with a
controlled concentration and temperature for dispensing chemicals
directly onto wafers.
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