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New Product: KLA-Tencor extends e-beam performance on new eS32 platform |
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Feb 06, 2006 at 09:45 AM |
 Outline: KLA-Tencor has introduced the eS32 e-beam inspection
platform. The eS32 enables the industry's widest capture of subtle
electrical and small physical defects, which are arising as chipmakers
integrate numerous new materials and device architectures into volume
production. In addition to providing a proven BEOL solution, the eS32
offers the wide range of imaging conditions required to capture the
growing number of yield-limiting FEOL defect types. Volume shipments of
the eS32 are underway, according to the company.
Problem: Today, with the fast feedback provided by e-beam
inspection, logic manufacturers can identify and overcome FEOL issues
in integrating nickel silicide (NiSi) and strained silicon into their
devices. Furthermore, the eS32 is architected to meet the yield
challenges that chipmakers are likely to encounter as they address
device speed and power consumption concerns. DRAM manufacturers face
shorter product lifecycles and, therefore, are increasingly focused on
ramping new processes into high volume production. As these
manufacturers scale to increasingly smaller cells, they face critical
FEOL and interconnect challenges-from inspecting higher aspect ratio
vias and capacitors to addressing the increasing yield impact of small
physical defects. The eS32 can help to promptly identify critical
defect mechanisms impacting DRAM manufacturers.
Solution: The eS32 incorporates important advancements in
physical and voltage contrast sensitivity to enable faster time to root
cause. Landing energy range has been extended to enhance capture
of slight under-etch contact defects. New beam current and
scanning flexibility options have been designed for use on highly
resistive materials, and to capture the growing array of subtle buried
shorts associated with NiSi and strained silicon integration. The
capture of small physical defects in dense, high aspect ratio
structures has been improved with the addition of a smaller
pixel. To help chipmakers accelerate root cause analysis and
identify and resolve new systematic defect mechanisms, the eS32 is
integrated with advanced binning algorithms. The eS32 also
supports KLA-Tencor's proprietary "MicroLoop" methodology, which the
company claims can accelerate yield learning by 50 percent.
Applications: Defects, electrical & physical for FEOL & BEOL 65nm and below.
Platform: The eS32 has enhanced ease-of-use capabilities, such
as auto-calibration for imaging conditions, allow the system to be
quickly and smoothly integrated into production.
Availability: January 2006 onwards.
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Wafer Processing 