|
New molecular engineered interlevel dielectric patent issued to Silecs |
|
|
|
Jan 31, 2006 at 03:07 PM |
 Silecs, Inc., a manufacturer of dielectric materials has received a new
US patent, US 6,974,970, that covers several chemical compositions for
materials used as interlevel dielectrics.
The company stated that applications requiring high aspect ratio
gap-fill and planarization combined with thermo-mechanical robustness
and optimized electrical performance were the key reasons for seeking
the patent.
"We are taking a unique molecular engineering approach to developing
new products that match our customers' process requirements and help
resolve IC manufacturing roadblocks. This fundamental development
approach also yields strong patent coverage for our products," said Dr.
Juha Rantala, Chief Technology Officer of Silecs.
The company now has over 30 patents in the field of molecular materials.
|
News 
