Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow News arrow Materials & Gases arrow New Order: AMD signs SOI wafer contract for 2006 worth $150m with Soitec
New Order: AMD signs SOI wafer contract for 2006 worth $150m with Soitec Print E-mail
Jan 16, 2006 at 07:23 PM
ImageAdvanced Micro Devices has signed a new one year contract with Soitec for both 200mm and 300mm SOI wafers for the 2006 calendar year, as reported by Soitec today in releasing its third quarter financial results.

AMD has been a large user of Soitec's 200mm SOI wafers, which have been ramped to full capacity at AMD's Fab 30 facility in Dresden, Germany. Fab 36, AMD's first 300mm fab is expected to ramp in 2006. The wafer order percentage split between the two wafer sizes was not disclosed.

 


Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
AMD’s volume ramp off the rails  (02/07/2007)
TSMC ramping 300mm fabs aggressively  (26/04/2007)
Soitec plans global expansion and new research  (07/07/2006)
TSMC to continue ramping 200mm and 300mm fabs in 2006  (27/04/2006)
Soitec sees SOI sales increase significantly  (15/11/2005)

Related jobs
Design Engineer Manager  (Williston, 15/10/2007)
Product Marketing Manager  (San Jose, 14/09/2007)
Product Engineer - Design Analysis & Characterization  (Williston, 15/08/2007)
Product Engineer - Design Analysis & Characterization  (Williston, 15/08/2007)
Design Engineer  (Williston, 15/08/2007)
Blog
Download
Subscribe
300mm