Jagdish Prasad, AMI Semiconductor, Pocatello, ID, USA

ABSTRACT

There are only minor changes in mateirals and structures at 65nm and therefore very little change in cleaning strategy for FEOL will be needed. Dedicated single-wafer tools for critical process steps may be needed to avoid crosscontamination. However, dedicated tools to all FEOL processes may be cost prohibitive and therfore it will be necessary to understand the processes that will require dedicated tools. Dilute and batch process will still be the process of choice for DRAM manufacturers but more single-wafer tools may be used by logic device manufacturers.