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New Product: CyberOptics wafer sensor meets space limitation in small footprint tools Print E-mail
Nov 25, 2005 at 05:22 PM
Product Briefing Outline: CyberOptics Semiconductor, has made its wafer mapping sensors in a smaller package to accommodate applications where space is limited or a smaller sensor footprint is desired. The EX-QS features the same capabilities as standard size EX-Q mappers, which are used for the detection of semiconductor wafers and slotting errors in cassettes or FOUPs.

Problem: The sensors are insensitive to interference from the mapping environment because their patented dual and wide beam technologies and built-in ambient light filter minimize stray reflections and fluorescent lighting influences. The EX-QS sensors have no moving parts, thus eliminating any potential for particulate contamination; and because they employ reflective technology, the sensors are non-intrusive, thereby mitigating the chance of wafer damage during mapping. The sensors can be used as replacement for other reflective sensors that are challenged by highly reflective, dark or ultra-thin wafers.

Solution: Like the standard EX-Q, the EX-43QS and EX-73QS sensors utilize reflective laser technology, and optimize the sensors' optical plane geometry to virtually eliminate any potential for stray reflections from FOUPs, cassettes, or other wafers. As a result, these sensors can quickly and reliably detect all types of wafers regardless of diameter, edge geometry, thickness or coating. They utilize laser transmitters and receivers fine-tuned for maximum sensitivity to excel at detecting dark wafers at factory gain settings and are compatible with flatted or notched wafers of any size including 300mm. The EX-QS employs an extremely thin (0.05 mm) laser stripe combined with multiple apertures and spatial filtering to reduce noise and ensure consistent detection of thin and cross-slotted wafers at one gain setting.

Applications: Used in a wide variety of applications as well as applicable to highly reflective, dark or ultra-thin wafers.

Platform: The EX-QS Series Class 1 sensors are an easy to use "off-the-shelf" solution that requires no amplification or signal conditioning, and can be mounted on wafer handling devices. They come in two stand-off distances: 1.5-inch and 2.2-inch, have operating ranges from 1.4- to 2.35- inches, and conform to IEC 60825-1 (2001-08) laser safety and to the laser safety requirements of SEMI S2-0200.

Availability: October 2005 onwards

http://www.cyberopticssemi.com/products/EXQ.html

 


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