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New Product: Wafer weight measurement tool to atomic levels from Metryx |
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Dec 13, 2005 at 12:46 PM |
 Product Briefing Outline: Metryx has launched the Mentor SF3 weight
metrology tool that offers atomic layer measurement accuracy and is
designed to handle the demands of volume production environments where
only a single 300mm wafer cassette is required.
Problem: In 300mm production, there are many physical wafer parameters
that engineers would like to monitor to ensure their production
processes perform to specification. These could be step coverage
in thin films to sidewall profiles in etch. A key point about weight
metrology is that if any of these physical wafer parameters have even
minor shifts, then this will bring about a mass change. Metryx is able
to measure this change at the atomic level and provide trend monitoring
or SPC solutions. It does this without any interference to the
process or wafer.
Solution: The Metryx Mentor SF3 tool is designed to monitor changes in
process performance and quickly determine whether device manufacture
process steps are operating correctly. The innovative
nanotechnology weight measurement system allows process changes to be
reliably and accurately determined after deposition, wet or dry etch or
CMP processing, according to the company. The tool is able to
resolve to 10micrograms (approximately one Angstrom of material
thickness).
Applications: Weight measurement of product, test and blanket wafers independent of substrate size or material.
Platform: Mentor SF3 tool feature a single 300mm Front Opening Unified
Pod, FOUP, located at 90° to the right of the normal user
interface. The system's robot is contained within a
mini-environment and is designed to access either 13 or 25 wafer
FOUPs. The system utilizes FOUP adaptors to meet 200-300mm bridge
tool requirements. Pre-identification of the FOUP adaptors by the
tool enables seamless handling.
Availability: December 2005 onwards.
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Product Briefings 