RICHARD WANG, SHELBY LAURENTS & CHARLES LYNN, Fluor Microelectronics

ABSTRACT

Along with traditional engineering, procurement and construction (EPC), the profitable nextgeneration 300mm fab will require the integration of physical, logical and people systems on an enterprise-wide basis. This article looks at the inherent challenges within the fab itself, along with outside-the-industry models that are now being refined to suit semiconductor manufacturers.