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New Product: Versatile atomic level weight metrology tool from Metryx |
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Jan 10, 2006 at 06:16 PM |
 Product Briefing
Outline: A new, non-destructive,
nanotechnology weight metrology tool has been introduced by Metryx to handle
high volume production of 300mm semiconductor wafers. The Metryx Mentor DF3 has
also been designed to easily adapt to handling a mixed wafer fab environment
where 200mm and 300mm wafers are continually interchanged.
Problem: Designed to monitor changes in process performance and
quickly determine whether device manufacture process steps are
operating correctly the tool enables process changes to be reliably and
accurately determined after deposition, wet or dry etch or CMP
processing.
Solution: The system offers atomic layer measurement accuracy using
innovative nanotechnology weight metrology methods pioneered by
Metryx. The tool is capable of measuring down to resolutions as
low as 10microgram (approximately one Angstrom of material thickness),
according to the company. It is claimed to have throughputs in excess
of 60 wafers per hour with a footprint of only 2m² and provides
nanotechnology weight measurement of product, test and blanket wafers
independent of substrate size or material.
Applications: Both 200 and 300mm wafers
Platform: The new metrology tool is equipped with a standard Equipment
Front End Module (EFEM) housing an atmospheric robot within a
mini-environment. The wafer handling capabilities of the tool
rely on two 300mm Front Opening Unified Pods, FOUPs, located side by
side at the front of the system. For use as a bridge tool, one of the
tool's load-ports can be configured for 200mm (either open cassette or
SMIF) operation while the other remains at 300mm. If more
measurement capacity is required then an additional measurement station
can be mounted on the system. The tool is able to pre-identify
the FOUP adaptors to achieve seamless handling.
Availability: January 2006 onwards.
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Wafer Processing 