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A new power semiconductor fabrication facility based in Asia has ordered Trikon Technologies, Sigma fxP metal deposition cluster tool. The first Sigma fxP system to ship to the new fabrication facility will provide contact/barrier and interconnect layers onto power management devices. Barrier layers will be deposited using Hi-Fill; Trikon's patented barrier deposition module that achieves increased film thickness at the base of deep contact holes. For interconnect, thick aluminum layers will be deposited at high rate in modules with very low maintenance schedules.

 "We are delighted to have won this order. This order validates our efforts to increase the contribution from Asia to our revenues," said Dr. John Macneil, President and CEO at Trikon Technologies. "We continue to invest resource into power specific technology in both our metal deposition and etch groups in order to increase both the productivity and capability of our tools. Power IC manufacturers are very cost driven and this order confirms the high throughput and low operating cost of the Sigma fxP. 35% of the top 20 power semiconductor manufacturers now use Trikon's equipment."