By Dr Mike Cooke

Tokyo Electron Limited (TEL) says that it will begin accepting volume orders for its latest 300mm CELLESTA single wafer cleaning system in April 2006.

The new tool targets front-end-of-line (FEOL) critical cleans, advanced gate, and surface preparation for 90nm technologies, down to at least 45nm. Although the company press release uses terms such as ‘unique' and ‘original' (and this is no doubt true for the specific method of application), many of the buzzwords of modern wafer cleaning are in evidence.

Specifically, CELLESTA employs an environmentally friendly Single Vapor Ozone Strip system for resist removal (claimed as ‘unique'). The tool also offers two wet spin chamber options for FEOL surface preparations using SC1, SC2, and HF chemistries. Wafer drying using an IPA-based system eliminates watermarks and damage on sensitive structures (claimed as ‘original'). An Atomized Spray advanced surface clean provides high particle removal efficiency with no pattern or surface structure damage. The Atomized Spray is available with SC1.

The CELLESTA platform is based on TEL's market-leading CLEAN TRACK ACT 12 system used in lithography.