|
|
|
Jul 21, 2008 at 05:27 PM |
New Product: New ‘Producer eHARP’ SACVD system from Applied meets 32nm STI gap-fill requirements
|
112 |
|
Jul 21, 2008 at 04:51 PM |
New Product: Nikon Instruments’ new wafer loader handles down to 100 micrometers
|
105 |
|
Jul 18, 2008 at 03:20 PM |
New Product: Alchimer’s eG ViaCoat offers conformal film deposition for TSVs
|
208 |
|
Jul 14, 2008 at 11:37 AM |
New Product: The Magellan XHR SEM from FEI enables 3D surface images
|
299 |
|
Jun 25, 2008 at 06:06 PM |
New Product: Aviza’s Versalis fxP offers fully integrated TSV processing
|
898 |
|
Jun 25, 2008 at 02:49 PM |
New Product: Lam Research targets 1nm CD uniformity with the 2300 Versys Kiyo3x etcher
|
779 |
|
May 29, 2008 at 04:21 PM |
New Product: Novellus tackles resist strip process divergence with two new systems
|
1657 |
|
May 19, 2008 at 09:39 AM |
New Product: ULVAC Technologies doubles throughput on next generation Enviro ‘Optima’ resist strip
|
1868 |
|
May 15, 2008 at 01:23 PM |
New Product: Rudolph reduces CoO for macro defect inspection with new AXi 940 module
|
1991 |
|
May 14, 2008 at 11:58 AM |
New Product: Applied Materials’ Inflexion edge polishing system cleans in a single pass
|
1605 |
|
May 08, 2008 at 03:47 PM |
New Product: Mattson’s new ‘Alpine’ dry strip system offers 35 percent lower CoO
|
1652 |
|
Feb 11, 2008 at 05:27 PM |
New Product: Axcelis’ Optima XE offers 10keV to 4MeV energy range for widest application range
|
3049 |
|
Feb 11, 2008 at 04:05 PM |
New Product: Nanometrics targets advanced CD control issues with NanoCD Suite
|
2705 |
|
Dec 05, 2007 at 05:22 PM |
New Product: Applied Materials’ ‘SEMVision’ G4 offers one defect-per-second review rate
|
3440 |
|
Dec 04, 2007 at 04:19 PM |
New Product: TEL’s CELLESTA+ offers 333 wph throughput for FEOL critical cleans
|
2692 |
|
Dec 03, 2007 at 04:32 PM |
New Product: KLA-Tencor offers the Aleris 8500 for composition and film thickness measurement
|
2620 |
|
Dec 03, 2007 at 04:23 PM |
New Product: KLA-Tencor combines bare wafer flatness, shape, edge roll-off and nano-topography in 1
|
2100 |
|
Nov 29, 2007 at 04:29 PM |
New Product: Applied Materials adds ‘FullVision’ real-time control to CMP platform
|
2043 |
|
Nov 29, 2007 at 11:46 AM |
New Product: Bevel-edge tool from Lam Research offers complete wafer flow single system cleaning
|
2460 |
|
Nov 26, 2007 at 06:41 PM |
New Product: Applied Materials offer 40 percent greater throughput with ‘UVision 3’ inspection tool
|
2002 |
|
Nov 13, 2007 at 04:21 PM |
New Product: CyberOptics’ new ‘WaferSense’ Auto Vibration System tackles equipment vibration issues
|
1917 |
|
Nov 13, 2007 at 02:18 PM |
New Product: ATMI’s ‘AutoClean’ ion implanter increases source life by over 40 percent
|
2224 |
|
Nov 02, 2007 at 03:21 PM |
New Product: FEI’s Titan3 reduces environmental interference
|
1823 |
|
Oct 18, 2007 at 04:02 PM |
New Product: Low cost development WLP deposition tools offered by Surfect Technologies
|
1953 |
|
Oct 04, 2007 at 10:49 AM |
New Product: Tokyo Electron delivers high-k CVD capability on Trias refined platform
|
2083 |
|
Sep 06, 2007 at 04:45 PM |
New Product: IR 3100S small spot MBIR system from AMS measures DRAM 3D etched structures
|
2161 |
|
Sep 06, 2007 at 04:31 PM |
New Product: Rudolph’s Explorer platform clusters multiple inspection tasks in one tool
|
2168 |
|
Sep 06, 2007 at 11:19 AM |
New Product: IR3100N extended wavelength MBIR system from AMS provides measurement of 3D structures
|
1775 |
|
Aug 22, 2007 at 03:56 PM |
New Product: Novellus enters 300mmPrime time with Vector Extreme
|
2473 |
|
Aug 14, 2007 at 02:32 PM |
New Product: KLA-Tencor’s SURFmonitor replaces AFM’s for bare wafer inspection
|
1884 |
|
Jul 24, 2007 at 04:31 PM |
New Product: Intevac’s novel ‘Lean Etch’ platform posts 200wph productivity
|
1829 |
|
Jul 24, 2007 at 03:27 PM |
New Product: Oxide spacer system from Applied Materials enables 32nm self-aligned DP
|
2269 |
|
Jul 09, 2007 at 02:41 PM |
New Product: New KLA-Tencor HRP-350 uses 20nm diamond stylus to speed topography profiling
|
2141 |
|
Jul 04, 2007 at 04:05 PM |
New Product: Tevet achieves two second per wafer measurement cycle for CVD processes
|
1756 |
|
Jul 04, 2007 at 03:01 PM |
New Product: New wafer defect review system from KLA-Tencor addresses SEM Non-Visual defects
|
2001 |
|
Jul 03, 2007 at 02:20 PM |
New Product: VLSI Standards offers calibration and system monitoring of wafer-edge exclusion zone
|
1978 |
|
Jun 28, 2007 at 05:10 PM |
New Product: Ashable hard mask process from Novellus targets high aspect ratio etch
|
2186 |
|
Jun 28, 2007 at 12:42 PM |
New Product: KLA-Tencor tackles critical defect inspection with two new dedicated brighfield tools
|
1627 |
|
Jun 25, 2007 at 02:46 PM |
New Product: Lam’s new Motif etch system targets 10nm post-lithography CD shrinks
|
2847 |
|
Jun 19, 2007 at 02:24 PM |
New Product: Advanced circuit edits handled by FEI’s V600CE FIB tool
|
1529 |
|
Jun 19, 2007 at 12:49 PM |
New Product: KLA-Tencor’s Puma 9150 offers improved defect capture at 45nm & below
|
1705 |
|
Jun 14, 2007 at 11:06 AM |
New Product: FEI’s DualBeam Expida 1255S offers full wafer STEM capabilities
|
2255 |
|
Jun 05, 2007 at 12:43 PM |
New Product: FEI launches first remote diagnostics program for microscopy tools
|
1825 |
|
Jun 04, 2007 at 02:17 PM |
New Product: Applied Materials offers BLOk II PECVD system for barrier films at 45nm and below
|
2109 |
|
May 17, 2007 at 12:24 PM |
New Product: PDF Solutions’ new software targets memory fabs for focused ramp & yield enhancements
|
1814 |
|
May 15, 2007 at 03:20 PM |
New Product: Applied Materials adds 30 percent more silicon strain in the Producer Celera
|
2195 |
|
May 10, 2007 at 02:25 PM |
New Product: Negevtech upgrades defect sensitivity in its Argus 3200 inspection tool
|
1622 |
|
Apr 04, 2007 at 05:06 PM |
New Product: 80:1 aspect ratio etched trenches reported on Applied’s Centura Mariana
|
2304 |
|
Apr 04, 2007 at 04:49 PM |
New Product: Novellus extends PECVD technology to the 45nm node with higher productivity
|
2639 |
|
Feb 08, 2007 at 06:13 PM |
New Product: KLA-Tencor’s Surfscan SP2XP has 30nm defect sensitivity
|
2388 |
| |
|
Results 1 - 50 of 109 |
Wafer Processing 
