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300mm Report
Home arrow Wafer Processing arrow Articles arrow Edition 20
Edition 20 - Published November 2003
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 Date Item Title Hits
Oct 31, 2003 at 12:00 AM 20th Edition: Process optimization – the key to obtain highly reliable Cu interconnects 390
Oct 31, 2003 at 12:00 AM 20th Edition: Evolution of copper plating chemistry requirements for the sub-90-nm node 598
Oct 31, 2003 at 12:00 AM 20th Edition: Confronting the low-k challenge: if it does not improve RC, why bother? 744
Oct 31, 2003 at 12:00 AM 20th Edition: Rapid thermal processing of Cu/low-k interconnections for 65-nm technology node and... 744
 
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