Joseph Hess, STMicroelectronics' Rancho Bernardo Facility, San Diego, CA, USA

ABSTRACT

Large Semiconductor manufacturers are under strict regulation for best environmental practice from both international organisations and local administrations. STMicroelectronics has developed environmental objectives for its facilities worldwide. Some of the mechanisms used by ST to meet these objectives are discussed in detail. 

Mikael Forsland & Sean O'Reilly, Camfil AB, Sweden

ABSTRACT
 
Cleanroom environments have classically been constructed to protect persons or processes against particulate contamination in the air. Today, the amount of airborne gaseous species arriving at a surface is much larger than that of particulate species. This fact is already well known under the name "airborne molecular contamination" (AMC). AMC is far more difficult to control than particles. Nevertheless, there are solutions available that concentrate on either eliminating the source or purifying the contaminated air. Some such solutions are described here. 

Megan Bouhamama & Arnold Steinman, Ion Systems, Berkeley, CA, USA

ABSTRACT

Electrostatics management in the factory. Industry trends needing electrostatics management; electrostatic discharge (ESD) damage issues; attraction of particle contamination; equipment problems due to ESD; controlling static charge in equipment; controlling static charge in the cleanroom.
The E78-0998 Static Budget Guide. Test methodologies and acceptable levels for static charge; definition of static sensitivity levels; test instrumentation (ESD simulators, Faraday cup, electrostatic fieldmeter, and EMI locators).Conclusions. Static-charge control has been recognised by SEMI as essential to ensuring equipment productivity. A comprehensive static-control programme requires grounding, dissipative materials, and air ionisation. 

Lfonso Mercurio, AMA Group, Rome, Italy & Singapore

ABSTRACT

The principal objective when designing a wafer fab is the creation of an effective architectural solution, with limited costs and easy construction, offering the simple and practical answer to a complex problem. This involves the compatible arrangement of highly specialised plant engineering, taking into consideration the diverse dimensions and quality of the various spaces, while guaranteeing flexibility to a structure which must undergo repeated technological modifications. Furthermore, the large size of these complexes means that they have a major impact on the urban and suburban setting, and consequently they represent the production philosophy and economic status of a company. 

John J. Plata, Texas Instruments, Inc., Dallas, TX, USA

ABSTRACT

300mm production factories require billion dollar plus investments in facilities, infrastructure, and manufacturing tools. The facilities, tool sets and manufacturing protocols for 300mm wafer fabs are quite different compared to state-of-the-art 200mm fabs. These factors present both the obligation and opportunity to make a step-function move toward sustainability and lower cost by optimising resources in all areas of the 300mm fab. 

ABSTRACT

In the semiconductor industry, most gases are hazardous and toxic. Mass Flow Controller manufacturers calibrate their devices with a surrogate gas and apply a correction factor to simulate thebehaviour of the process gas. However, when this constant factor is used, the accuracy of the calibration is not precise. Qualiflow has made a numerical simulation of the sensor of the Mass Flow Controller to build polynomial correction factors.

ABSTRACT

PFA (tetrafluoroethylene and perfluoroalkylvinylether copolymer) is used to manufacture tubing, wafer baskets, tank linings, etc. used in the wet processes of the semiconductor industry. We have developed a new type of PFA to meet the market demand for higher purity and performance. Its main characteristic is reduced spherulite size, which is controlled to improve the transparency, smoothness, and solution permeability of the final components.

ABSTRACT

The stainless steel tubing used in high purity gas distribution systems is being specified with a lower manganese content by end users in an effort to improve corrosion resistance, especially for welded systems exposed to corrosive gases. This new material trend has been examined experimentally and no benefit is shown when the manganese content is reduced. The combined effects of other elements by themselves or in combination with manganese plays a more significant role in the corrosion resistance of the alloy.

The outsourcing of certain aspects of Fab critical operation, such as gas and chemical management, has become to be regarded as an accepted strategic option. However, the move to an outsourced total facility solution is a controversial option that many present-day executives would find difficult to accept as a profitable proposal. The author explains these difficulties and explores the alternative methodologies.

Plasma-based processes are critical to the fabrication of semiconductor device structures and to the integrity of CDs. PVD, HD-PCVD, PECVD, dry etch, and strip all rely on dc and RF sources to ignite and maintain the energy of the plasma to do work. There are multiple methodologies available to deliver power to the plasma, using fixed match, switch match, auto-selectable switch match, and sweep frequency. Further, these methods are very amenable to point-of-use delivered power control. This paper focuses on the benefits to be derived from two of these methods: fixed match and closed-loop delivered power control. 

ABSTRACT

Those who have a need for quality Transient Voltage Surge Suppression (TVSS) equipment find themselves in a quandary when it comes to selecting one device from the many devices available in the market today. The information available upon which to base a decision is contained in magazine articles, advertising material, personal advice, and manufacturers' specification sheets.

ABSTRACT

Wafer fabs consume large quantities of power and water. With the transition to 300 mm, the trend of increasing consumption must be reduced. This paper presents strategies to reduce energy and water consumption.

W. DOUGLAS OBAL, DuPont Company, Wilmington, DE, USA

ABSTRACT

Ductwork systems are used in the semiconductor and allied industries to safely transport highly corrosive chemicals and vapours. Over time, however, these substances can invade the walls of the duct by the process of permeation, resulting in leakage or even loss of structural integrity. The mechanism of permeation is explained in detail, yet predicting its effects can still be risky. Metal ducts having a thin fluoropolymer lining have demonstrated that the effects of permeation can be controlled and the risks mitigated.

PATRICK H. SCHNABEL & PATRICIA M. LINDLEY, Charles Evans & Associates, Redwood City, CA, USA
DAVID NEHRKORN & MARIUS KENDALL, Surface Science Laboratories, Mountain View, CA, USA

ABSTRACT

In this study we use TOF-SIMS (Time-of-Flight Secondary Ion Mass Spectrometry), GC/MS (Gas Chromatography/ Mass Spectrometry) and FTIR Spectroscopy (Fourier Transform Infrared) for the identification of different types of airborne molecular contaminants that outgas from cleanroom materials. The materials under investigation include construction materials (e.g., floor tiles, filters and sealants), cleanroom furniture, garments and utensils.

Robert Jansen, Lend Lease-Crystal, Eindhoven, The Netherlands

ABSTRACT

Throughout the history of the semiconductor industry, technological advances have demonstrated an amazing pace of evolution. Over the last two decades they have taken us from 2.0 micron feature sizes and 100 mm wafers to 0.18 micron and 200 mm wafers. With the start of the new millennium we are on the verge of introducing 0.13 micron technology on 300 mm wafers. The transition to these new technologies will go hand in hand with huge investments in facilities and tools. As a result the semiconductor business community is starting to reconsider the way in which these assets are to be developed and managed.

Chris Robertson, Chris Robertson and Associates, Portland, OR, USA

ABSTRACT

Conservation of resources and energy efficiency is an enterprise with many variables. The issues for implementing such a policy are not necessarily obvious or result in the most expensive option. A comprehensive monitoring of the relevant data requires great expertise. The problems are discussed in detail and various solutions illustrated with vivid examples. 

ABSTRACT

An electrical transient is a temporary excess of voltage and/or current in an electrical circuit. Businesses are highly vulnerable to transients. This article describes the sources of transients and explains the need for transient voltage surge suppression (TVSS) devices. Points to consider in the selection of TVSS devices are listed, and comments are made on the costs of the effects of transients.

ABSTRACT

Vibration isolation legs, used in place of the rigid tool legs found on sensitive lithography and metrology tools and electron microscopes, can eliminate the need for the tool pedestals that are currently used to create "vibration-free" environments for these tools (or supplement pedestals in the case of extremely sensitive tools). Similarly, vibration isolation legs, used in place of rigid tool legs on vibration-source tools such as implanters and CMP tools, eliminate the need for the tool pedestals currently used to reduce the transmission of vibrations from these tools into the general fab floor. This development lowers the cost of tool ownership and the cost of relocating tools, while also reducing the level of vibration contamination in a fab. 

ABSTRACT

The microelectronics industry is at the threshold of the 300-mm transition and appropriate vibration criteria for the design of next generation chip fabrication (fab) facilities have not been formally proposed. This article identifies the need for modifications to the "generic" vibration design criteria to address the low frequency sensitivities of metrology tools.  For steppers and scanners active vibration isolation is becoming a feasible way to mitigate external and internal vibrations. We believe that better engineered tools will be the primary driver towards successful chip fabrication for linewidths at and below 0.15 microns. The historical "generic" criteria, with our proposed modifications, will provide a solid basis for the design of next generation fabs. 

Allan D. Chasey & Saloni Merchant, Arizona State University, Tempe, AZ, USA

ABSTRACT

This paper will discuss the key areas in which research is needed to facilitate the design and construction of 300 mm fabs by giving the reader a broad overview of these issues, focusing mainly on areas that will have the maximum impact. While not providing solutions, it is intended to be a compilation of much of the discussions on 300 mm technology and to act as a catalyst for further discussion.