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Product Briefing Outline: NEHP has introduced a family of modules that help tool installers dramatically decrease the time, cost and complexity of a fab installation. The new line features a  Read More
Product Briefing Outline: Purafil has introduced its 2nd Generation MediaPAK Disposable Plastic Module for clean air filtration systems. The module features the new Taper Fit Closure (TFC), which offers  Read More
Product Briefing Outline: Integrated Dynamics Engineering (IDE) has launched its generation AWP 300-2 wafer sorter. The AWP 300-2 uses a unique dual robot design that is claimed to achieve reliable  Read More
Cleanroom

The Cleanroom section covers all aspects of fab construction and cleanroom operations. In more recent years with the shift to 300mm wafers, topics covered have been concerned primarily with 300mm facilities. Articles are commissioned from experts in their fields that include IC manufacturers, Fab designers, Constructors and Universities from around the world.



10th Edition:Micro-Vibration Criteria for 300 mm and Beyond Print E-mail
Jun 03, 1999 at 05:45 PM
Keith W. Leung & Chris A. Papadimos, Advanced Engineering Solutions, Fairfax, CA,USA

ABSTRACT

The microelectronics industry is at the threshold of the 300-mm transition and appropriate vibration criteria for the design of next generation chip fabrication (fab) facilities have not been formally proposed. This article identifies the need for modifications to the "generic" vibration design criteria to address the low frequency sensitivities of metrology tools.  For steppers and scanners active vibration isolation is becoming a feasible way to mitigate external and internal vibrations. We believe that better engineered tools will be the primary driver towards successful chip fabrication for linewidths at and below 0.15 microns. The historical "generic" criteria, with our proposed modifications, will provide a solid basis for the design of next generation fabs. 

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10th Edition:Construction Challenges for the 300 mm Fab Print E-mail
Jun 03, 1999 at 05:42 PM

Allan D. Chasey & Saloni Merchant, Arizona State University, Tempe, AZ, USA

ABSTRACT

This paper will discuss the key areas in which research is needed to facilitate the design and construction of 300 mm fabs by giving the reader a broad overview of these issues, focusing mainly on areas that will have the maximum impact. While not providing solutions, it is intended to be a compilation of much of the discussions on 300 mm technology and to act as a catalyst for further discussion.

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10th Edition: Activity-Based Fab Cost-of-Ownership Modelling for Prediction and Optimization Print E-mail
Jun 03, 1999 at 05:16 PM

Tony Wells & Julie Paddon, M+W Zander Facility Management UK Ltd, Newcastle upon Tyne, UK

ABSTRACT

In the quest for improved capital effectiveness, combined with cost and risk reduction within the semiconductor manufacturing industry, the fab costof- ownership model described in this article has been conceived. It provides a comprehensive management tool to maximize return on investment, understand the detailed cost base and look for best-practice processes through benchmarking.

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10th Edition: Site Analysis, Selection, and Development: Exposed vs. Sheltered High Technology Print E-mail
Jun 03, 1999 at 05:14 PM
Danny Lam Fisher-Holstein, Inc., San Jose, CA, USA
John Kanz, Fisher-Holstein, Inc., Scotsdale, AZ, USA

ABSTRACT

Cisco Systems means advanced computer networks; it's the leading router and data networking design and manufacturing company whose equipment is virtually synonymous with the Internet. As of March of this year, Cisco employed about 8300 in the San Francisco Bay area. Recently they decided to expand operations with a new seven million square-foot, $1 billion campus that will house 20 000 workers, representing an additional 11 700 jobs. Given the scale, nature, and prestige of this new facility, it is one of the all-time great site selection prizes. 

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10th Edition: Energy Efficiency Opportunities in Silicon Ingot Manufacturing Print E-mail
Jun 03, 1999 at 09:06 AM
Bryan Fickett, Greg Mihalik, Siemens Solar, Vancouver, WA, USA


ABSTRACT

Energy and argon are two costly components used in the Czochralski (CZ) growth of silicon ingot. Siemens Solar Industries (SSI), in cooperation with the Northwest Energy Efficiency Alliance (NEEA), are developing a method which significantly reduces consumption of these costly resources. A discrete finite element package was used to model CZ growth conditions on a Kayex CG6000 crystal growth furnace. Based on these simulations an energy efficient hotzone was designed and assembled. The modifications resulted in substantial reductions in energy and argon, as well as improvements in productivity, yield, and ingot characteristics.

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9th Edition: Preventing Fires in Semiconductor Cleanrooms Print E-mail
Nov 04, 1998 at 11:22 AM

Lawrence Shea, Shea Technology, Reno, NV, USA

This article describes some basic considerations about minimizing the potential for fires in cleanrooms. Most of the information presented herein is in the form of direct quotes from the National Fire Protection Association #318 Standard for the Protection of Cleanrooms.

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9th Edition: Point-of-Use Exhaust Control for Semiconductor Manufacturing: Saving Energy... Print E-mail
Nov 04, 1998 at 11:20 AM

Daniel Hall, Progressive Technologies, Inc., Tewksbury, MA, USA

A means to reduce energy consumption while improving both operator safety and product yield is discussed. Furthermore, details of a simple, reliable, fail-safe system for reducing the overall flow of air through the facility are given. 

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9th Edition:Benchmarking Wafer Fabrication Process Tool Hook-up A Proposed Standard Methodology Print E-mail
Nov 04, 1998 at 11:14 AM

A. WELLS, Siemens Microelectronics Ltd., Newcastle on Tyne, UK

As time to market and product life cycles become progressively shorter, ref [1], the focus on a fast tool Hook-up to provide an opportunity for early first silicon is becoming even more critical. With a depressed semiconductor market situation however, the reduction of capital expenditure is the primary focus, ref [2]. The goal of this article is to understand the underlying processes involved in Hook-up and optimise them to provide the "best practice", lowest cost and time solution. The article will also disprove the current paradigm that high speed necessarily means high cost, and the following text summarises the method for the much more detailed study undertaken this year.

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9th Edition: Effective Construction Cost and Schedule Control Print E-mail
Nov 04, 1998 at 10:58 AM

M. EL-MASHALEH, Royal Corps of Engineers, Jordan Armed Forces, Jordan
DR. A.D. CHASEY, Arizona State University, Tempe, AZ, USA

One of the most important challenges facing construction project managers today is controlling cost and schedule overruns. Cleanroom projects with their associated aggressive schedules and budget limits present management with the tremendous task of tracking resources and developing timely and efficient schedules. A cost and schedule control system must be devised to deliver these projects successfully on time and within budget. Based on a research survey conducted among twenty-two construction management professionals involved in cleanroom construction from general contracting companies and construction management firms, this article defines how construction cost and schedule controls for cleanroom facility projects are accomplished and identifies the keys for effective construction cost and schedule control.

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