John J. Plata, Texas Instruments, Inc., Dallas, TX, USA

ABSTRACT

300mm production factories require billion dollar plus investments in facilities, infrastructure, and manufacturing tools. The facilities, tool sets and manufacturing protocols for 300mm wafer fabs are quite different compared to state-of-the-art 200mm fabs. These factors present both the obligation and opportunity to make a step-function move toward sustainability and lower cost by optimising resources in all areas of the 300mm fab. 

ABSTRACT

In the semiconductor industry, most gases are hazardous and toxic. Mass Flow Controller manufacturers calibrate their devices with a surrogate gas and apply a correction factor to simulate thebehaviour of the process gas. However, when this constant factor is used, the accuracy of the calibration is not precise. Qualiflow has made a numerical simulation of the sensor of the Mass Flow Controller to build polynomial correction factors.

ABSTRACT

PFA (tetrafluoroethylene and perfluoroalkylvinylether copolymer) is used to manufacture tubing, wafer baskets, tank linings, etc. used in the wet processes of the semiconductor industry. We have developed a new type of PFA to meet the market demand for higher purity and performance. Its main characteristic is reduced spherulite size, which is controlled to improve the transparency, smoothness, and solution permeability of the final components.

ABSTRACT

The stainless steel tubing used in high purity gas distribution systems is being specified with a lower manganese content by end users in an effort to improve corrosion resistance, especially for welded systems exposed to corrosive gases. This new material trend has been examined experimentally and no benefit is shown when the manganese content is reduced. The combined effects of other elements by themselves or in combination with manganese plays a more significant role in the corrosion resistance of the alloy.

The outsourcing of certain aspects of Fab critical operation, such as gas and chemical management, has become to be regarded as an accepted strategic option. However, the move to an outsourced total facility solution is a controversial option that many present-day executives would find difficult to accept as a profitable proposal. The author explains these difficulties and explores the alternative methodologies.

Plasma-based processes are critical to the fabrication of semiconductor device structures and to the integrity of CDs. PVD, HD-PCVD, PECVD, dry etch, and strip all rely on dc and RF sources to ignite and maintain the energy of the plasma to do work. There are multiple methodologies available to deliver power to the plasma, using fixed match, switch match, auto-selectable switch match, and sweep frequency. Further, these methods are very amenable to point-of-use delivered power control. This paper focuses on the benefits to be derived from two of these methods: fixed match and closed-loop delivered power control. 

ABSTRACT

Those who have a need for quality Transient Voltage Surge Suppression (TVSS) equipment find themselves in a quandary when it comes to selecting one device from the many devices available in the market today. The information available upon which to base a decision is contained in magazine articles, advertising material, personal advice, and manufacturers' specification sheets.

ABSTRACT

Wafer fabs consume large quantities of power and water. With the transition to 300 mm, the trend of increasing consumption must be reduced. This paper presents strategies to reduce energy and water consumption.

W. DOUGLAS OBAL, DuPont Company, Wilmington, DE, USA

ABSTRACT

Ductwork systems are used in the semiconductor and allied industries to safely transport highly corrosive chemicals and vapours. Over time, however, these substances can invade the walls of the duct by the process of permeation, resulting in leakage or even loss of structural integrity. The mechanism of permeation is explained in detail, yet predicting its effects can still be risky. Metal ducts having a thin fluoropolymer lining have demonstrated that the effects of permeation can be controlled and the risks mitigated.

PATRICK H. SCHNABEL & PATRICIA M. LINDLEY, Charles Evans & Associates, Redwood City, CA, USA
DAVID NEHRKORN & MARIUS KENDALL, Surface Science Laboratories, Mountain View, CA, USA

ABSTRACT

In this study we use TOF-SIMS (Time-of-Flight Secondary Ion Mass Spectrometry), GC/MS (Gas Chromatography/ Mass Spectrometry) and FTIR Spectroscopy (Fourier Transform Infrared) for the identification of different types of airborne molecular contaminants that outgas from cleanroom materials. The materials under investigation include construction materials (e.g., floor tiles, filters and sealants), cleanroom furniture, garments and utensils.