N. Van Hoornick, K. Van den Broeck, J. Van Hoeymissen & M. Heyns, IMEC, Heverlee, Belgium, W. Riedel & C. Braun, M+W Zander, Stuttgart, Germany

ABSTRACT

This article describes a life-cycle cost model that takes the complex interaction between activities in IC facilities within a fab into account. In addition, the model provides all necessary outputs for environmental impact modelling such as gaseous emissions, concentrations of wastewater compounds, etc. 

Yeong Ruey Shiue, GSMC, Shanghai, People's Republic of China & Stephen M. Malmros AIA, IDC, Shanghai,Peoples Republic of China

ABSTRACT

A microelectronics manufacturing facility developed by Grace Semiconductor Manufacturing Corporation (GSMC) in Shanghai has been closely watched as a watershed project in China's technology evolution. The project has justifiably become a dramatic symbol of China's emergence as a dynamic hub of microelectronics manufacturing. The GSMC project team creatively combined aesthetic appeal, design and construction ingenuity, design/build systems packaging, and a unique degree of cultural sensitivity and adaptation to local conditions to achieve success on this landmark project. Significantly, this project was accomplished with an eclectic international team that shared a common commitment to meet the high quality standards expected by GSMC. 

Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

This is the first article in a series that will look at the many facets that make up the design, construction and cleanroom installation aspects of the state-of-the-art 300mm fab. The focus will be on initiatives that help to control the rising costs and maximise the return on investment (ROI). We start the series where all fabs must start, on the drawing board or as we have today the CAD computer screen. Here we interview one of the most experienced and creative fab architects in the world today with no less than 20 fabs to his name. We asked Dr. Alfonso Mercurio President of A.M. Architetti S.r.l, part of the AMA Group, to reveal the often forgotten or underestimated importance of design in fabs of today. 

Dr. Martin Weltzer, Siemens Industrial Building Consultants GmbH & Co. OHG, Munich, Germany

ABSTRACT

The article describes the SC300 ultrapure water (UPW) plant as an example how the project objective was realized and includes information about design aspects, water quality specification and vendor selection criteria's. The UPW plant is one of the key elements of the production facility. Beside the cost aspects the plant has to meet stringent quality specifications to secure the wafer yield. Based on a calculated cost target, which was derived from Infineon's 300mm business plan and the experiences gained from earlier 200 mm Fabs, the UPW expert team developed different technical concepts and they investigated the resulting investment and operating costs. 

Ed Guttes, Fiona Lee & Monty Stranski, IDC, Portland, OR, USA

ABSTRACT

The goal of a Fab plant designer is to maximise cost effectiveness of the plant area to the technology to be used. This is a complex issue with a high degree of uncertainty when future requirements are brought into the evaluation. A graphical analysis based on wafer throughput and other relevant factors is shown to produce an optimum range of values upon which the Fab Designer can base his new development with some confidence. 

Victor Neuman, Alpha Tech, Inc., San Francisco, CA, USA

ABSTRACT

This article outlines the current difficulties with electrical power being experienced by semiconductor manufacturers in northern California. Cogeneration and on-site power generation are seen as possible solutions to these problems. In addition, cogeneration can reduce emissions of harmful globalwarming gases, e.g. CO2, and several examples are presented. 

Phil Naughton, Motorola Facilities Technology Center, Austin, TX, USA

ABSTRACT

Semiconductor factories have always been a large consumer of electrical energy and there is an on-going introspective examination by many semiconductor companies to reduce their energy consumption as part of their global environmental policies. With the current slowdown in the semiconductor industry many semiconductor companies have also been reviewing expenses to identify opportunities for cost savings. Motorola has scrutinised its energy conservation policies in its semiconductor operations and the result has had significant progress in reducing operating expenses. 

M. Shams Tabrez, Evans Analytical Group, Sunnyvale, CA, USA

ABSTRACT

With the ever-burgeoning cost of fabs and the constant need to bring new products to market quickly, the pressure to compress time lines is critical. Fabs are themselves evolving the way they do business, in ways such as centralising R&D to focus core research and developmental efforts and driving towards consistency across plants around the world. The impact on semiconductor manufacturers is to look for key strategic partnerships that can travel with them and so help fabs maintain their competitive position. 

Allan D. Chasey, Del E. Webb School of Construction, Tempe, AZ, USA
Rajashekar Bistaiah, M.A. Mortenson Company, Colorado Springs, CO, USA

ABSTRACT

Contamination control, which has a direct impact on the productivity and profitability of the manufacturing process, is the central concept around which all cleanrooms are designed, built and operated. To help control construction contamination, two methodologies have been used: (1) clean the facility at the end of the construction, called "final super clean", or (2) continuous cleaning during construction, called "clean-build". The "clean-build" method is the most widely used contamination control method; however, very little is known about the actual benefit of the "clean-build" approach versus the "final super clean" approach.