Martin L. Spartz, Matthew Richter, Peter A. Rosenthal & Peter R. Solomon,
On-Line Technologies, Inc., East Hartford, CT, USA

ABSTRACT

Gases utilised and generated during semiconductor fabrication can be monitored in real-time by infrared spectroscopy to determine the wafer state information during semiconductor manufacturing. Whereas methods based on quadrupole mass spectroscopy (QMS) residual gas analysis (RGA) tend, at best, to produce relative quantitative results, infrared spectroscopy can provide absolute quantitative gas chemistry data. Gas chemistry changes are excellent diagnostics of processing variations or errors such as first wafer effects, chamber temperature effects, improperly chucked wafers, variation in plasma power, system leaks, and variation in gas flows from mass flow controllers.

Reproduced by permission of The Electrochemical Society, Inc.

Laurie Beu & Paul Thomas Brown, Motorola, Austin, TX, USA

ABSTRACT

Fluorinated compounds (FCs) are essential to the semiconductor manufacturing process for plasma chamber cleaning and plasma etching. Because FCs have extremely long atmospheric lifetimes and are strong infrared absorbers, efforts have been undertaken to identify methods to reduce atmospheric emissions.This paper will provide an overview of FC emissions reduction technologies including effectiveness and cost to implement. The factors affecting establishment of long term FC emissions reduction goals will be discussed and several goal strategies and their impact on long-term emissions will be analysed. 

This article reviews the way in which Novellus Systems has addressed several important environmental issues. Emissions of global-warming gases, such as PFCs, need to be reduced by significant amounts by semiconductor device manufacturers by the year 2010. In addition to PFCs, HF and F₂ emissions must also be reduced. These emissions come primarily from chamber clean processes. Novellus has developed chamber clean processes that demonstrate dramatic reductions in emissions of both, solving two environmental problems at once.

ABSTRACT

Based on the trend towards smaller microprocessor feature sizes and the physical properties of copper, the use of copper-based deposition processes in semiconductor processing is increasing. This article describes several types of copper-based semiconductor fabrication processes and provides a detailed analysis of the environmental regulatory issues associated with the introduction of copper-based deposition processes into integrated circuit (IC) manufacturing operations in the United Kingdom, Ireland, Singapore and Taiwan.

David Benzing, Benzing Technologies, Inc., San Jose, CA, USA
Samir Shiban, IESI, Chandler, AZ, USA

Dynamic oxidation is a highly effective method to abate pyrophoric gases in the effluent of semiconductor processing tools. The technique achieves high conversion efficiencies without active burning or added heat, by forced turbulent mixing of the pyrophorics with air. Through maximizing the contact with oxygen, dynamic oxidation exploits the high reactivity of pyrophorics to ensure their abatement.

ABSTRACT

The need has been created for emission measurement equipment capable of extremely precise quantification of both process gases and process gas by-products. One such technology includes the use of mobile Fourier transform infrared (FTIR) spectroscopic equipment for emissions characterization. This article presents the design, capabilities, and testing methodologies of an extractive FTIR system used in process effluent testing on two epitaxial tools at the STMicroelectronics, Carrollton, Texas facility.

Andrew Seeley, Phil Chandler, Steve Cottle & Peter Mawle,
BOC Edwards Exhaust Management Systems, Nailsea, UK

ABSTRACT

The gaseous by-products of a Semiconductor Fab contain some very stable PFCs and the prevention of environmental contamination is a major problem for the Fab engineer. The reactant products from any gaseous clean-up have a nasty habit of clogging up the decontamination system and can cause continual process interruption and loss of production. An ingenious system has been developed which circumvents these problems by use of a ceramic matrix combustion system. This method could well have wide ranging applications when extended to industries other than our own.

Sally D. Rand, United States Environmental Protection Agency, Washington DC, USA

ABSTRACT

Semiconductor manufacturers are setting an example for other industries by taking aggressive action to reduce emissions of greenhouse gases. The industry realized early that its use of potent greenhouse gases harmed the environment and its business reputation. The semiconductor industry, through the leadership of the World Semiconductor Council (WSC), is breaking new ground on environmental protection by working with governments to develop and implement a global emission reduction strategy. 

Alison M. McDougall, Munters, Amesbury, MA, USA
Camille N. Luckadoo, Texas Instruments, Santa Cruz, CA, USA

As a result of two major fab remodels in the last seven years, Texas Instruments' Santa Cruz, California site (see Figure1) has been involved in an on-going production ramp. This plant, part of TI's storage products group, manufactures semiconductors primarily for the disk drive market. As fab loading nears capacity, production levels over the next several months are projected to result in the (unabated) potential- to-emit (PTE) approaching the State and Federal BACT limits for VOC emissions. To prevent triggering these limits, TI chose to install a VOC abatement system to treat a portion of the VOC-laden exhaust sources from the fab. By being proactive and reducing emissions, TI will be able to avoid the BACT trigger levels. 

S. Raoux, Applied Materials, Santa Clara, CA, USA
J. G. Langan, Air Products and Chemicals, Allentown, PA, USA

As part of a program to reduce emissions of global warming gases from semiconductor production equipment, a major advance in dielectric CVD (chemical vapour deposition) chamber cleaning is available that virtually eliminates perfluorocompounds (PFC) emissions from the process. Using NF₃ gas in a remote microwave plasma source, the near-total dissociation of the gas achieves both superior chamber cleaning performance and improved environmental friendliness. NF₃ has been shown to be safe and of relatively low toxicity when used according to accepted handling procedures. The remote microwave clean technology also enables higher productivity and improved economic performance of the CVD process, including higher throughput and lower cost of consumables.