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Fab management  The Fab Management section is primarily concerned with leading edge
IC facilities' operational endeavours in ramp and full production
environments. It covers a broad range of topics and issues that
impact productivity, throughput and cycle times. Also included are
articles covering market, business and technology trends that relate
directly or indirectly with fab operations at the macro level.
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Feb 03, 2000 at 10:44 AM |
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BILL MCCLEAN, IC Insights, Inc., Scottsdale, AZ, USA ABSTRACT Pure-play foundry companies (companies that focus entirely on producing ICs for other companies) are some of the most aggressive spenders on IC capacity additions. Their sales are expected to approach $10 billion in 2000. Growth in foundry business can be expected to attract new competitors. Some new entrants may be in the form of joint ventures. IC Insights believes that the emergence of pure-play foundries will have a major impact in the future IC industry. Write Comment (0 comments) |
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Sep 03, 1999 at 02:28 PM |
STEVE HAUSLE, GW Associates, Sunnyvale, CA, USA
ABSTRACT Implementing "islands of software" will address the challenges of the multi-platform environment that exists in fabs worldwide. The main issue is being able to use the latest software tools and methods while working with the legacy systems and other systems still in use throughout the industry. Write Comment (0 comments) |
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Sep 03, 1999 at 02:25 PM |
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JOE BARTOLOMEO & J. D. DETREMPE, Rockwell Automation, Milwaukee, WI, USA ABSTRACT
Implementing Semiconductor Equipment and Materials International (SEMI) standards for semiconductor capital equipment has traditionally been a timeconsuming and tedious process, based on proprietary software programs, and requiring custom software development.Write Comment (0 comments) |
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Sep 03, 1999 at 02:23 PM |
STEVEN BUDDE, USDATA Corporation, Richardson, TX, USA
ABSTRACT Electronics manufacturers continue to expand their service offerings to encompass those functions that they can more cost effectively, efficiently and successfully perform for their customers. This trend is expected to continue, as electronics manufacturers become more significant value chain contributors, specifically in the areas of design, procurement, test, logistics, and sales and marketing.
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Sep 03, 1999 at 02:20 PM |
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DONALD P. MARTIN, IBM Microelectronics Division, Essex Junction, VT, USA ABSTRACT
The investment required for a new semiconductor manufacturing line is currently in excess of $2B. Improving asset utilisation by increasing equipment productivity has been a major focus in order to maximise the profit of a line in the face of this significant investment.Write Comment (0 comments) |
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Sep 03, 1999 at 02:16 PM |
STEVE LERNER & CLAUDIO TRUZZI, CS2, Zaventem, Belgium
ABSTRACT The high integration level and low-latency device characteristics offered by current IC technologies have moved the bottleneck limiting system performance away from the IC level into the packaging field. This article analyses the need for integration between the semiconductor and packaging levels.
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Sep 03, 1999 at 02:14 PM |
JOHN SCHULER, SEMI Market Statistics Dept., SEMI, Mountain View, CA, USA
ABSTRACT Latest statistical data obtained from many sources of device manufacturers, equipment suppliers and other relevant companies has been analysed to show various trends in the industry for a number of years. The statistics are collated for the principle geographic areas of semiconductor fabrication. The results are discussed and explained and possible future trends outlined.
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Feb 03, 1999 at 04:41 PM |
CHARLES H. GIFFORD, Power Engineers, Inc. Hailey, ID, USA
JUSTIN TYLER & MARK F. DUENAS, Power Engineers, Inc. Boise, ID, USA
ABSTRACT To compete in the evolving global marketplace, companies are converting to the vertical business model. This model increases corporate efficiencies by providing real-time data into a predetermined decision-making process. Effectively moving real-time data to and from the plant floor through the MES, ASP, and MRP systems to the ERP system has become a major focus of the corporate transformation. Write Comment (0 comments) |
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Feb 03, 1999 at 04:38 PM |
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TODD C. WILLIAMS, Compaq Computer Corporation, Camas, WA, USA ABSTRACT
This article is a discussion of the needs of a recipe manager in today's fabs. It enumerates the high-level requirements for a full-featured recipe management system. It also describes the interrelationship of the functions, methods of utilization, and the incorporation of a recipe manager in the overall manufacturing system.Write Comment (0 comments) |
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Feb 03, 1999 at 04:34 PM |
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STEVEN BUDDE, USDATA Corporation, Richardson, TX, USA ABSTRACT
Semiconductor manufacturing operations are presently facing competitive pressures from all fronts to produce products more efficiently while supporting build-to-order environments. Flexible and agile production systems are now considered a must to enable semiconductor manufacturers to meet these high level objectives.Write Comment (0 comments) |
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Fab management 
Product Briefing Outline: Imera Systems has announced its next-generation network virtualization solutions for cross-enterprise e-Diagnostics and equipment knowledge base access. The solutions are claimed to connect manufacturers and equipment vendors
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Product Briefing Outline: Applied Materials has introduced the ‘Applied E3’ advanced equipment and process control solution, intended to be a comprehensive factory automation (FA) software package for improving the productivity
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Product Briefing Outline: Hach Ultra has introduced the MET ONE 6000 Series Remote Airborne Particle Counters, which offer accurate and reliable continuous particle monitoring. With a sensitivity range of 0.2
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