Product Briefing Outline: Applied Materials, Inc. today unveiled its most advanced defect review SEM, the Applied ‘SEMVision’ G4, which extends the technology and productivity of Applied's SEMVision system to 45nm-and-beyond applications. Key to the SEMVision G4 are its new SEM column technology and enhanced multi-perspective SEM imaging system (MPSI) that deliver 2nm physical resolution at a benchmark one-defect-per-second review rate. 

Product Briefing Outline: Applied Materials, Inc. today unveiled its most advanced defect review SEM, the Applied ‘SEMVision’ G4, which extends the technology and productivity of Applied's SEMVision system to 45nm-and-beyond applications. Key to the SEMVision G4 are its new SEM column technology and enhanced multi-perspective SEM imaging system (MPSI) that deliver 2nm physical resolution at a benchmark one-defect-per-second review rate. 

Product Briefing Outline: Tokyo Ohka Kogyo Co., Ltd. (TOK) and Dow Corning Electronics have jointly developed bilayer photoresist used for DRAM production applications. The new bilayer photoresist uses a Dow Corning silicon polymer in the imaging layer to provide better etch selectivity than other products on the market today, the company claims. Dow Corning and TOK have had a joint development agreement since 2002 to develop advanced silicon-based photolithography materials. 

Product Briefing Outline: Tokyo Ohka Kogyo Co., Ltd. (TOK) and Dow Corning Electronics have jointly developed bilayer photoresist used for DRAM production applications. The new bilayer photoresist uses a Dow Corning silicon polymer in the imaging layer to provide better etch selectivity than other products on the market today, the company claims. Dow Corning and TOK have had a joint development agreement since 2002 to develop advanced silicon-based photolithography materials.