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Product Briefings
Single-platform architechture for advanced contact and via-fill Print E-mail
Feb 04, 2005 at 09:00 PM
ImageProduct Briefing Outline: Novellus Systems, has launched "ALTUS DirectFill" - a single-system solution designed to meet contact and via-fill needs at 65 nm and below. DirectFill eliminates the need for conventional titanium/titanium nitride (Ti/TiN) toolsets. This advanced plug-fill technique can reduce contact resistance (Rc) and lower overall cost of ownership (CoO) by 50 percent or more when compared to existing processes, the company claims.

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Cost-effective sub-50 nanometer lithography using step and flash nano-imprinting Print E-mail
Feb 04, 2005 at 08:00 PM
ImageProduct Briefing Outline: Molecular Imprints' new " Imprio 250" nano-imprint system uses Step and Flash Imprint Lithography "S-FIL" technology. The Imprio 250 offers sub-50 nm half-pitch resolution, sub-10 nm alignment, as well as integrated magnification control, and delivers high resolution and precision alignment for customers seeking cost-effective lithography.
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Barrier slurry for low-stress/low-pressure CMP Print E-mail
Feb 04, 2005 at 08:00 PM
ImageProduct Briefing Outline: Rohm and Haas Electronic Materials CMP Technologies, a leader in polishing technology for the global semiconductor industry, today introduced another new barrier slurry optimized for low-stress/low-pressure chemical mechanical planarization (CMP) of copper semiconductor devices. SSA Barrier Slurry, targeted at 90nm and 65nm CMP, provides consistent performance, excellent defectivity and a large processing window, leading to improved yields and cost of ownership for low-k applications. Customer-proven in both capped and uncapped integration schemes, SSA Barrier Slurry minimizes microscratches, improves sheet resistance, and lowers overall defect counts versus conventional slurries.Write Comment (0 comments)
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Ellipsometric porosimetry meets low-k film characterisation requirements Print E-mail
Feb 04, 2005 at 08:00 PM
ImageProduct Briefing Outline: Sopra has launched the EP5 and EP12 tools which are based on Ellipsometric porosimetry (EP). This is a unique technology to characterize CVD and spin coated porous ultra low-k materials. EP measures the change of the optical properties and thickness of the materials during adsorption and desorbtion of an organic solvent.Write Comment (0 comments)
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Filter life estimates gain online web assistance Print E-mail
Feb 04, 2005 at 07:00 PM
ImageProduct Briefing Outline: Donaldson Company has launched the "Filter Life Estimator," a new web-based tool that enables semiconductor fabricators using ASML Lithography Tools to plan filter maintenance schedules based on the contaminant mix in their particular operation.
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