Product Briefing Outline: Pixer Technology has launched ‘Galileo,’ which it claims to be the industry’s first high speed, high resolution DUV metrology tool that enables measurement of DUV transmission with a 0.1 percent resolution limit and is sensitive to transmission changes of 0.01 percent. The tool is for use on advanced mask blanks at the 45nm node and below. 

Product Briefing Outline: Pixer Technology has launched ‘Galileo,’ which it claims to be the industry’s first high speed, high resolution DUV metrology tool that enables measurement of DUV transmission with a 0.1 percent resolution limit and is sensitive to transmission changes of 0.01 percent. The tool is for use on advanced mask blanks at the 45nm node and below. 

Product Briefing Outline: KLA-Tencor has launched a new family of reticle inspection systems that takes into consideration the different needs of logic and memory fabs, as well as different mask generations. These include the ‘TeraFab SLQ-2X,’ which is designed for leading-edge logic fabs. The ‘TeraFab Q-3X’ is designed for multiple-die re-qualification and incoming quality control (IQC) applications common to memory fabs, and the ‘TeraFab SLQ-1X,’ which offers a lowest cost of ownership (CoO) alternative, is suited to go/no-go functions for single-die inspection typical of logic fab requalification applications. TeraFab systems are currently undergoing beta testing and evaluation at leading 45nm-generation logic and memory fabs, in Japan, Taiwan and Europe. 

Product Briefing Outline: KLA-Tencor has launched a new family of reticle inspection systems that takes into consideration the different needs of logic and memory fabs, as well as different mask generations. These include the ‘TeraFab SLQ-2X,’ which is designed for leading-edge logic fabs. The ‘TeraFab Q-3X’ is designed for multiple-die re-qualification and incoming quality control (IQC) applications common to memory fabs, and the ‘TeraFab SLQ-1X,’ which offers a lowest cost of ownership (CoO) alternative, is suited to go/no-go functions for single-die inspection typical of logic fab requalification applications. TeraFab systems are currently undergoing beta testing and evaluation at leading 45nm-generation logic and memory fabs, in Japan, Taiwan and Europe.