Product Briefing Outline: GF Piping Systems has introduced the new Type 567 Butterfly Valve in large diameter sizes up to 12 inches.  The new corrosion-resistant valve incorporates a double eccentric operating principle that provides improved wear and easier operation over traditional eccentric style butterfly valves.  Typical applications include industrial water treatment and waste water systems. 

Product Briefing Outline: GF Piping Systems has introduced the new Type 567 Butterfly Valve in large diameter sizes up to 12 inches.  The new corrosion-resistant valve incorporates a double eccentric operating principle that provides improved wear and easier operation over traditional eccentric style butterfly valves.  Typical applications include industrial water treatment and waste water systems. 

Product Briefing Outline: Levitronix has introduced the new ‘BPS 600’ magnetically levitated pump technology, designed for demanding applications in the semiconductor industry such as CMP slurry delivery, copper electroplating and wafer cleaning at leading-edge process nodes. The patented impeller floats in a magnetic field only touching the fluid it is pumping, and can be fully integrated into a fully-closed loop electronic control system without the need of additional controller hardware. 

Product Briefing Outline: Applied Materials has introduced the ‘Applied Inflexion’ edge polishing system for high-precision defect removal that polishes and cleans the critical wafer edge region. The Applied Inflexion is claimed to be the only system that polishes the entire wafer edge, removing film stack residues and shallow surface defects in a single pass while minimizing the exclusion area in order to maximize the number of good die. In addition, the system precisely controls the edge profile, enabling process engineers to tailor the film-to-wafer interface to meet a wide range of integration requirements.