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New Product: Applied Materials’ ‘Tetra’ Reticle Clean reaches >99% particle removal efficiency Print E-mail
May 08, 2008 at 04:54 PM

ImageProduct Briefing Outline: Applied Materials has introduced the Applied ‘Tetra’ Reticle Clean, which it claims is the industry’s only wet clean system that delivers damage-free, >99% particle removal efficiency for 32nm-and-beyond photomasks. The Tetra Reticle Clean system is said to set a new standard for productivity, offering up to four times the throughput of any competing system. 

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New Product: Applied Materials’ ‘Tetra’ Reticle Clean reaches >99% particle removal efficiency Print E-mail
May 08, 2008 at 04:54 PM

ImageProduct Briefing Outline: Applied Materials has introduced the Applied ‘Tetra’ Reticle Clean, which it claims is the industry’s only wet clean system that delivers damage-free, >99% particle removal efficiency for 32nm-and-beyond photomasks. The Tetra Reticle Clean system is said to set a new standard for productivity, offering up to four times the throughput of any competing system. 

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New Product: Mattson’s new ‘Alpine’ dry strip system offers 35 percent lower CoO Print E-mail
May 08, 2008 at 03:47 PM

ImageProduct Briefing Outline: Mattson Technology has added the ‘Alpine’ system to its family of dry strip products. The Alpine system was developed to address advanced low temperature photoresist strip processes on back-end-of-line (BEOL) and front-end-of-line (FEOL) applications for future technology nodes with a single tool. Specifically, the tool is designed to tackle the challenges of advanced low-k and other complex materials. The company noted that it has shipped its initial Alpine system to a major semiconductor manufacturer in Taiwan. 

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New Product: Mattson’s new ‘Alpine’ dry strip system offers 35 percent lower CoO Print E-mail
May 08, 2008 at 03:47 PM

ImageProduct Briefing Outline: Mattson Technology has added the ‘Alpine’ system to its family of dry strip products. The Alpine system was developed to address advanced low temperature photoresist strip processes on back-end-of-line (BEOL) and front-end-of-line (FEOL) applications for future technology nodes with a single tool. Specifically, the tool is designed to tackle the challenges of advanced low-k and other complex materials. The company noted that it has shipped its initial Alpine system to a major semiconductor manufacturer in Taiwan. 

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New Product: Applied Materials’ ‘Aera2’ detects defects according to patterning impact Print E-mail
Apr 15, 2008 at 10:28 AM

ImageProduct Briefing Outline: Applied Materials has introduced the ‘Applied Aera2’ Mask Inspection system that is designed to handle leading-edge photomask inspection and qualification tasks at the 45nm node and below, including double patterning. The Aera2 uses sophisticated aerial imaging technology to immediately see how the pattern on the mask will appear on the wafer. The system detects defects according to their impact on the wafer, filtering out the large number of non-printing defects that plague conventional mask inspection systems. Applied Materials claims that the Aera2 system addresses all mask shop inspection applications and provides more than twice the throughput of any competing system. 

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