Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Critical Components
Critical Components Product Briefs   RSS Feed
Product Briefing Outline: A unique Roller Pinion System (RPS) from Nexen Group, Inc., allows machine designers to incorporate highly accurate linear and rotary motion-control functions with zero backlash and speeds  Read More
Product Briefing Outline: Entegris has introduced the new Torrento family of high-flow liquid filters that help improve liquid contamination control of nano-scale particles in wet etch and clean (WEC) manufacturing  Read More
Product Briefing Outline: Aerotech’s WaferMax T rotary stage was originally designed for the demands of precision wafer inspection; however, due to its low height design it can be used in  Read More
Critical Components
The Critical Components & Sub-Systems section acknowledges the growing contribution of innovations in this field that can have a significant benefit to wafer tool performance, fab operations and technology targets. A broad range of topics are covered that can cover the latest vacuum pump technology for 300mm fabs to the latest developments in precursor gas valve's for Atomic Level Deposition (ALD).


18th Edition: Suppliers of critical subsystems make significant contributions to productivity and... Print E-mail
Mar 21, 2003 at 02:48 PM

John West, VLSI Research

ABSTRACT

In recent years equipment manufacturers have increasingly looked to their supply base for the design and engineering of subsystems and components for their products. At the same time we’ve seen the end users of equipment also taking advantage of these companies’ expertise to improve the productivity and performance of their installed tools. Both these trends have contributed to the subsystem industry’s raised profile beyond that of mere suppliers of components. 

Write Comment (0 comments)
Read more...
18th Edition: Advanced technologies in CMP slurry systems reduce wafer damage Print E-mail
Mar 21, 2003 at 02:41 PM

Scott Robichaud & Katsuhiro Ohnishi, Asahi

ABSTRACT

Chemical Mechanical Planarization (CMP) slurry systems have created many new challenges in the semiconductor fabrication industry.
Certain types of CMP slurries consisting of suspended solids in solution are abrasive, and traditional components used in wet process
systems, such as diaphragm valves, can damage these slurries.

Write Comment (0 comments)
Read more...
<< Start < Previous 1 2 3 Next > End >>

Results 29 - 30 of 30
Subscribe
300mm