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Feb 02, 2007 at 09:14 AM |
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 Spansion has said that it has completed the conversion of its Submicron Development Center in Sunnyvale, CA from 200mm process tools to 300mm. The effort was made in advance of readying Spansion's SP1 300mm JV manufacturing facility in Japan, starting in late 2007 with a 65nm process.
The Submicron Development Center is staffed by approximately 500 employees.
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Jan 30, 2007 at 07:00 PM |
 Cypress Semiconductor Corp. has sold its Silicon Valley Technology Center ("SVTC") business to private equity firms Oak Hill Capital Partners and Tallwood Venture Capital for approximately $53 million in cash.Write Comment (0 comments) |
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Jan 29, 2007 at 05:18 PM |
 With the completion of 45nm process technology development expected at the end of 2007, the announced exit of NXP Semiconductor from the Crolles2 Alliance at that time, and the expected withdrawal of Freescale, the future of Europe's leading semiconductor R&D facilities is in doubt.
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Jan 26, 2007 at 12:03 PM |
 Chartered Semiconductor has raised capital spending projections for 2007 in an effort to further ramp its 300mm facility, Fab 7, to accommodate customers planning ramps at the 65nm node this year. Chartered will spend approximately $800 million on equipment this year, compared to $554 million in 2006.
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Jan 25, 2007 at 02:21 PM |
 Elpida Memory plans to increase capital spending over the next 4 months in an effort to increase production of DDR DRAM due to expected demand in the second half of the year. The dedicated DRAM memory manufacturer had previously outlined CapEx spending for FY2006 to be ¥120 billion, down slightly from FY2005 of ¥124.5 billion. However, CapEx is now expected to reach ¥145 billion in FY2006, a 20 percent increase over the previous forecast.
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Jan 24, 2007 at 04:14 PM |
 Toshiba and SanDisk have announced that they are preparing to enter volume production of MLC NAND flash devices at the 56nm node in the first quarter of 2007 at Toshiba's Fab3, a 100,000wspm 300mm fab. 8-Gigabit devices will first be offered with the plan to make available 16-Gigabit devices in the second quarter of this year.
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Jan 22, 2007 at 09:44 AM |
 Dai Nippon Printing Co. Ltd. (DNP) plans to start construction of a leading-edge (65nm & below) photomask plant in the Hsinchu Science Park in Hsinchu, Taiwan in April 2007. The new facility - its first in Taiwan - is being built to meet the expected increase in demand for photomasks in the country requiring feature sizes below 65nm in the coming years as well as meeting requests for shorter supply chain and better technical collaboration.
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Jan 18, 2007 at 03:32 PM |
 AMD has announced that it has completed the construction of its new Bump and Test facility, adjacent to Fab 30 in Dresden, Germany. Tool installation is now taking place in the 20,000m² building.
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Jan 08, 2007 at 01:51 PM |
 UMC has started construction of its third 300mm fab at an estimated cost of $5 billion US Dollars, the company has said in a press statement. The new fab will be located in Taiwan's Tainan Science Park, adjacent to its existing 300mm facility, Fab 12A. UMC has another 300mm facility in Singapore. The new fab is expected to have a capacity of 50,000 wafer starts per month and is expected to be completed by the end of 2007. First phase tool install is expected in the first quarter of 2008.
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Dec 07, 2006 at 02:36 PM |
 Elpida Memory, Inc. and Powerchip Semiconductor Corp. (PSC) have formed a new Joint Venture (JV) company that will operate up to four 300mm fabs that will be based at the Central Taiwan Science Park (CTSP) in Taichung, Houli, Taiwan. The new JV will also see PSC gain access to Elpida's advanced DRAM process technology in the future.
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