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Apr 24, 2007 at 05:36 PM |
 Elpida Memory has set aggressive new targets for ramping its 70nm DRAM process over plans originally detailed in January. Elpida said that due to a 50 percent price erosion Q-on-Q it is changing its plan to improve costs by significantly increasing the migration to 70nm.
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Apr 19, 2007 at 06:26 PM |
 Spansion has said that it is almost 6 months ahead of original plans to ramp its first 300mm fab, SP1, in Japan. The news came during a conference call with financial analysts yesterday, where the company stated that it was currently in the process of first silicon success with its 65nm process.Write Comment (0 comments) |
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Apr 13, 2007 at 03:38 PM |
 Samsung has said that it had spent 41 percent of planned capital spending for its memory chip division for the year in the first quarter. During a conference call with financial analysts, the company also said that DRAM memory capacity had declined due to a plan to convert some 200mm fabs to 300mm production that was now underway.
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Apr 06, 2007 at 05:01 PM |
 According to Wilbur Stover, Micron Technology's, Chief Financial Officer, the planned capital expenditure budget of $4.0 billion for its 2007 financial year has already seen two-thirds allocated in only two quarters.Write Comment (0 comments) |
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Apr 03, 2007 at 11:53 AM |
 Spansion has said that it has completed the sale of the JV1 and JV2 Manufacturing Facilities in Aizu-Wakamatsu, Japan to Fujitsu for approximately $150 million in cash. Spansion plans to use the money to help fund capital equipment purchases for its new 300mm facility SP1, currently nearing completion in Aizu-Wakamatsu, Japan.
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Mar 30, 2007 at 04:36 PM |
 In what is building into a bitter fight to regain control of Atmel Corporation, former founder and head of the chip manufacturer George Perlegos, ousted in a scandal over expenses, has urged shareholders to oust certain members of the board and cited strategy failings that are limiting investor shareholder value.Write Comment (0 comments) |
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Mar 30, 2007 at 01:46 PM |
 Elpida Memory has received approximately $1.35 billion in loans, secured by 45 separate financial institutions, so that it can expand DRAM capacity. The move was prompted by the recent agreement with Powerchip Semiconductor to establish a Joint Venture business called Rexchip Electronics Corporation that is nearing completion of a new 300mm facility in Taiwan.
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Mar 28, 2007 at 03:46 PM |
 With the recent ratification of incentives for attracting hi-tech industries that include semiconductors, India could now be on a path that will establish semiconductor front-end fabrication facilities. Perhaps first in the race to secure its share of the benefits is Hindustan Semiconductor Manufacturing Corporation, headed by Dr. Deven Verma (pictured).
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Mar 26, 2007 at 10:48 AM |
 Breaking a 15-year abstinence in building fabs on greenfield sites, as well as having front-end wafer fabrication facilities in Asia, Intel Corp. has confirmed in a press release that it will be building Fab 68, a 300mm facility in the coastal Northeast China city of Dalian in Liaoning Province, China.
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Mar 22, 2007 at 05:56 PM |
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 Inotera Memories has officially opened Fab 2 - its second 300mm memory fab in Taoyuan, Taiwan. The new fab has a capacity of over 60,000wspm (wafer starts per month) and is built adjacent to Fab 1 at a cost of over $2 billion when fully equipped.
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