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Dec 11, 2006 at 03:46 PM |
 A materials start-up just out of stealth mode, MEARS Technologies has claimed it has made a significant breakthrough in reducing gate leakage by as much as 60 percent in NMOS transistors and up to 80 percent in PMOS transistors, using conventional process techniques while introducing a silicon laminate, or ‘superlattice,' layer with no new materials introduced.
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Dec 07, 2006 at 05:54 PM |
 Entegris has surpassed the 300th ‘Aeronex' Gas Purification System installation that uses clean dry air as a gas purification solution with sub-parts-per-billion (ppb) capability.
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Dec 05, 2006 at 02:57 PM |
 Shin-Etsu Handotai, Ltd. (SEH) and SUMCO Corporation (SUMCO) are beta-system partners with KLA-Tencor for un-patterned wafer inspection technology using the Surfscan SP2 platform that is expected to be used at the 45nm node.
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Nov 20, 2006 at 04:44 PM |
 International Isotopes Inc is planning to commence production of germanium tetrafluoride (GeF4), using its acquired patents for the Fluorine Extraction Process. The FEP process utilizes depleted uranium tetrafluoride (UF4) as its primary raw material and selectively combines this material with other chemicals to produce the high purity fluoride compounds while using a classified waste product.Write Comment (0 comments) |
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Nov 20, 2006 at 01:57 PM |
 Applied Materials, Inc via its venture capital fund, Applied Ventures, LLC has invested $3.0 million US dollars in Solaicx, a privately owned manufacturer of single-crystal silicon wafers specifically designed for the solar photovoltaic (PV) industry.
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Nov 14, 2006 at 01:26 PM |
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 According to new figures released from SEMI's Silicon Manufacturers Group (SMG), Worldwide silicon wafer area shipments increased 5.5 percent in 3Q06, reaching 2,074 million square inches. This compares to growth on 4.4 percent in 2Q06 and 3.2 percent growth achieved in 1Q06 over 4Q05. The new quarterly total area shipments are over 18 percent above third quarter 2005 shipments, according to SMG.
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Nov 08, 2006 at 02:25 PM |
 In what could be seen as an unusual step by a materials supplier in the highly cost competitive global semiconductor manufacturing industry, Cabot Microelectronics Corporation has selectively raised prices globally on its ‘Semi-Sperse' and ‘Cab-O-Sperse' interlayer dielectrics and general-purpose oxide polishing slurries. The new prices will become effective for orders to be delivered on or after December 1, 2006, according to a company press statement.Write Comment (0 comments) |
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Oct 31, 2006 at 05:03 PM |
 ARM has quickly added to its Silicon-on-Insulator (SOI) activities after announcing a partnership with Soitec - the largest SOI wafer manufacturer - to develop IC cores specific to extracting the best from the SOI technology. ARM is now acquiring SOISIC, a Physical IP specialist in SOI designs that Soitec has previously invested in and is a spin-off from the Laboratoire d'Electronique de Technologie de l'Information (LETI).
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Oct 30, 2006 at 05:05 PM |
 BOC Edwards and Aviza Technology have entered into a Joint Development Agreement (JDA) to develop Atomic Layer Deposition (ALD) dissolved liquid and gaseous precursors for advanced semiconductor manufacturing applications.
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Oct 27, 2006 at 08:42 AM |
 Only three months ago, Rick Tsai, President and CEO of TSMC, the largest pure-play foundry, noted during a conference call with financial analysts that the company had no demand from customers to use SOI wafer technology. Now, Soitec, the market leader in SOI wafer manufacturing, has announced a joint-development agreement with ARM, the largest IP provider and the holder of most standardized/qualified IP designs across the foundry industry, not least with TSMC.Write Comment (0 comments) |
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| Results 99 - 112 of 214 |
Materials & Gases 
