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Jan 30, 2006 at 01:26 PM |
 A major US based IC manufacturer has signed a contract with IQE Silicon to provide epi wafer processing steps for a new range of IC devices the company is launching using epitaxial wafers for the first time.Write Comment (0 comments) |
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Jan 27, 2006 at 03:05 PM |
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 MEMC now plans to increase polysilicon production from 4,000 metric tons per year to 8,000 metric tons over a three year capacity increase plan. The company noted that demand for both semiconductor and solar power industries remains strong and prices of wafers have firmed in recent months.
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Jan 16, 2006 at 07:23 PM |
 Advanced Micro Devices has signed a new one year contract
with Soitec for both 200mm and 300mm SOI wafers for the 2006 calendar year, as
reported by Soitec today in releasing its third quarter financial results.
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Jan 04, 2006 at 01:00 PM |
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Voltaix, Inc., has been awarded a grant
from the National Science Foundation (NSF) SBIR/STTR Program to commercialize a
new family of low temperature silicon-germanium (SiGe) precursors the company
licensed from Arizona State University in September 2005. The value of the
grant was not disclosed.Write Comment (0 comments) |
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Jan 03, 2006 at 06:13 PM |
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MEMC Electronic
Materials has filed a lawsuit against the SOI market leader, Soitec in response
to its patents on defect-free silicon, referred to as "Perfect Silicon" being
upheld by the European Patent Office in October 2005.Write Comment (0 comments) |
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Dec 21, 2005 at 02:33 PM |
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Siltronic AG has placed equipment orders order worth around 8 million
euros with PVA TePla AG subsidiary, CGS GmbH to expand 300mm wafer
production. The crystal growing systems are scheduled for delivery by
the end of 2006.Write Comment (0 comments) |
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Dec 15, 2005 at 02:22 PM |
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Cabot
Supermetals and Honeywell's Electronic Materials have signed a global
cross-licensing agreement with respect to each others patents related to
tantalum (Ta) technologies used in the production of high-purity Ta metals and
sputtering targets.Write Comment (0 comments) |
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Dec 13, 2005 at 06:30 PM |
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Isonics Corporation has claimed that revenues
associated with its semiconductor operations has grown by 50 percent in the
quarter ended October 31, 2005 compared to the previous quarter. More than 90%
of the increase in semiconductor segment revenues is attributable to 300mm
wafer reclaim work.Write Comment (0 comments) |
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Dec 13, 2005 at 12:57 AM |
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Cabot Microelectronics Corporation has begun
construction of its Technology Services Center in ChuPei, Taiwan. The centre
should be completed in 1Q06 and will cater for CMP slurry formulation development,
specifically for copper interconnect applications.Write Comment (0 comments) |
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Dec 08, 2005 at 01:42 PM |
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By Dr Mike Cooke Toshiba and Sony announced development of carrier mobility enhancement and wiring process technology for boosting LSI performance at 45nm. Current drive performance has been improved through strained silicon technologies, enhancing carrier mobility. Further, a low-k film has been developed as inter-metal dielectric. Write Comment (0 comments) |
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| Results 169 - 182 of 225 |
Materials & Gases 
