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Materials & Gases News
Suntech solar wafer deal could net MEMC $6 billion Print E-mail
Jul 26, 2006 at 02:54 PM

ImageMEMC Electronic Materials has finalized the solar grade silicon wafer supply deal with China-based Suntech Power Holdings that could generate between $5 billion and $6 Billion US dollars in revenue for MEMC over the 10-year contract period.

 

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Soitec to offer global strain SOI wafers for 45nm node integration Print E-mail
Jul 18, 2006 at 03:47 PM
ImageGlobal strained SOI (sSOI) wafers are now available from Soitec the majority supplier and developer of silicon-on-insulator wafer substrates after a development program started several years ago (http://www.fabtech.org/content/view/765/73/)  to extend the performance attributes of SOI technology.Write Comment (0 comments)
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First ever joint venture bare wafer facility set-up by Samsung and Siltronic Print E-mail
Jul 17, 2006 at 07:31 PM
ImageSamsung Electronics Co and Siltronic AG, a division of Wacker Chemie AG have announced a Joint Venture company that will construct and operate a 300mm wafer manufacturing facility in Singapore with an intended capacity of 300,000, 300mm wafer production per month at a cost of $1.0 billion US dollars.Write Comment (0 comments)
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Soitec plans global expansion and new research Print E-mail
Jul 07, 2006 at 11:48 AM
ImageSoitec reported a new expansion development strategy aimed based on a growing worldwide demand for silicon-on-insulator (SOI) and other engineered substrates. The company plans to expand existing production capacity in France, while also adding a new production plant based in Singapore.Write Comment (0 comments)
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Ultrapure water supply for immersion litho Print E-mail
Jul 07, 2006 at 11:44 AM
ImageBy Dr Mike Cooke

Entegris is to introduce its LiquidLens ultrapure water (UPW) purification system aimed at the needs of immersion lithography next week at the SEMICON West show in San Francisco. The system combines advanced technology and process expertise from both Entegris and its Mykrolis "merger"/acquisition in August 2005.Write Comment (0 comments)
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Cabot acquires IBM CMP slurry patents Print E-mail
Jul 05, 2006 at 04:05 PM
CabotChemical mechanical planarization (CMP) specialist Cabot Microelectronics has entered into a patent assignment agreement with IBM to acquire a number of patents and associated rights relating to slurry technology, including various applications such as copper, copper barrier, tungsten, and dielectrics, among others.
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Best supplier award at Spansion’s Fab 25 goes to materials suppliers Print E-mail
Jun 26, 2006 at 05:14 PM
SpansionSpansion Inc has presented its ‘World Class Supplier' (WCS) Pathfinder Award for Best Supplier to Nikko Materials, for its sputtering targets that include copper and aluminum for interconnect; titanium and tantalum for barrier; and cobalt for gate applications. The same award was also given to Matheson Tri Gas a supplier of specialty gases to Spansion's 200mm, Fab 25, located in Austin, Texas.Write Comment (0 comments)
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BOC Edwards increasing chip grade nitrogen generation in Taiwan's Hsinchu Science Park Print E-mail
Jun 08, 2006 at 09:00 PM
BOC EdwardsBOC Edwards, with its Taiwan joint venture partner, BOC Lien Hwa (BOCLH), already operates the largest high purity gas distribution network in Taiwan, which supplies  Hsinchu Science Park in Taiwan. However the companies are to expand nitrogen production, pipeline distribution network and mass storage operations at a cost of over $30 million US dollars to meet continued demand from the semiconductor and related manufacturing facilities within the park.Write Comment (0 comments)
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Soitec acquires LETI spin-off for layer transfer technology Print E-mail
Jun 08, 2006 at 10:10 AM
SOI CleanroomSoitec has acquired TraciT Technologies, a company based close to Soitec in Grenoble, France and a spin-off start-up from CEA-Leti also located in Grenoble. According to Soitec, TraciT Technologies was on the verge of starting customer production. Financial details of the deal were not disclosed.Write Comment (0 comments)
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Tool Order: New Russian nanotech center selects FEI’s TEM’s Print E-mail
Jun 06, 2006 at 12:17 PM
FEIThe Russian Government is funding a new nanotech centre in Moscow to the tune of $400 million US dollars by the end of 2007, according to FEI Company, which has been selected as a key equipment supplier to the ‘Pilot Scientific and Technical Center of Excellence for Nanotechnology Development.'Write Comment (0 comments)
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