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Lithography News
EV Group teams with GenISys on simulation enhancements for mask aligner lithography Print E-mail
Feb 08, 2007 at 05:43 PM
MEMSEV Group (EVG) has formed a product development partnership with GenISys GmbH for the development and marketing of a simulation platform for advanced mask aligner lithography processes, specifically for MEMS. The partners aim to improve MEMS development times, yields and overall costs throughout the manufacturing process.

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Immersion double patterning preferred choice at 32nm, says Cymer Print E-mail
Jan 31, 2007 at 07:06 PM
Cymer Cymer executives noted during a conference call to discuss quarterly financial performance that the view of lithography experts attending Cymer's Annual Lithography Symposium, held in December, 2006 was that double patterning (DP) with Immersion tools was the preferred solution at the 32nm node. This consensus is due to EUV Lithography technology not being production ready for this node migration in 2009 and the slow development of viable high index liquids that could see the retention of single pass patterning.Write Comment (0 comments)
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Japan’s STARC center selects Blaze DFM for leakage power optimization Print E-mail
Jan 24, 2007 at 03:31 PM
Blaze2The Semiconductor Technology Academic Research Center (STARC) of Japan has selected Blaze DFM's software targeting low-power reference flows for 65nm and below designs by STARC members.

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ASML claims 61 percent lithography market share in 2006 Print E-mail
Jan 17, 2007 at 02:01 PM
XT:1900iASML posted record revenues for 2006 as well as record sequential revenues for the last three quarters of 2006 as revealed in their full-year financial results, announced today. 2006 net sales came in at €3.597 billion, up 42 percent compared with €2.529 billion in 2005. Q4 2006 net sales reached €1.068 billion, up 11 percent compared with Q3 2006 net sales of €958 million. In Q4 2006, ASML shipped 72 lithography systems (70 percent ArF: per value), including 64 new and 8 refurbished.

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Tool Order: ASML receives 2 more orders for EUV Lithography tools Print E-mail
Jan 17, 2007 at 12:01 PM
ASMLASML has announced that it has received 2 more confirmed orders from individual companies for pre-production EUV lithography tools. Deliveries are expected to begin in 2009, according to Eric Meurice, president and CEO of ASML during a press conference to discuss fourth quarter and year-end financial results.

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Tool Order: Semiconductor memory manufacturer to use imprint lithography from Molecular Imprints Print E-mail
Jan 11, 2007 at 05:15 PM
ImageAccording to Molecular Imprints, a leading semiconductor memory manufacturer has purchased its ‘Step and Flash Imprint Lithography' tool - an ‘Imprio 250' - for process development and device prototyping at 32nm node and below. The tool has already been shipped and is currently being installed, the company said.

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ASML plans takeover of computational lithography company Brion Print E-mail
Dec 19, 2006 at 01:59 PM
ImageASML Holding has agreed to acquire Brion Technologies, a provider of semiconductor design and wafer manufacturing optimization solutions for advanced lithography. The companies expect that the transaction will cost ASML $270 million cash. ASML also expects Brion to be cash positive in 2007.

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Tool Order: Powerchip orders production immersion tool from Nikon Print E-mail
Dec 14, 2006 at 12:50 PM
NIKON NSR-S610CPowerchip Semiconductor Corporation (PSC) has continued its long-standing supplier relationship with Nikon Precision with the memory manufacturer selecting Nikon's NSR-S610C ArF immersion scanner for its 50nm NAND Flash process at its 300mm fab 12M, located in Hsinchu, Taiwan and dedicated to NAND Flash production. This is one of the first production immersion tool orders for the NSR-610C, which uses catadioptric optics of NA 1.3. Shipment schedules were not disclosed.
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TOK launches new class of photo resist for 193nm ArF lithography Print E-mail
Dec 08, 2006 at 05:52 PM

TOK resistDow Corning Corp. and Tokyo Ohka Kogyo Co., Ltd. (TOK) have jointly developed a bilayer photoresist that uses a silicon polymer, previously not possible due to outgassing issues in the imaging layer, eliminating the need for other resist layers such as a hard mask for etch protection.

 

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TEL and ASML team on immersion lithography optimization Print E-mail
Dec 07, 2006 at 10:52 AM
LithiusTokyo Electron Limited (TEL) and ASML Holding NV plan to work more closely together in what the companies describe as a ‘long-term joint development program' that is designed to optimize both the lithography and track tools for improved performance for R&D and high-volume production for 45nm and future technology node processes.

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