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Jun 06, 2007 at 05:44 PM |
 The International Society for Optical Engineering better known by many as SPIE is officially changing its name for the first time since 1981 to SPIE.
The Society believes the name change better represents its growing
community of scientists, researchers and engineers in industry,
academia and government.
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Jun 06, 2007 at 03:45 PM |
 Rohm and Haas Electronic Materials has officially opened its expanded lithography materials-focused R&D center in Chonan, Korea. The $30 million investment in the facility will be dedicated to advanced 193nm ArF photoresist and anti-reflecting coatings development.
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Jun 05, 2007 at 04:19 PM |
 A U.S. manufacturer has placed a multi-million dollar order with Akrion for its GAMA ClearIQ wet station that will be used in the cleaning requirements necessary for extending the lifetime of the mask sets. ClearIQ employs Akrion's i-Clean vessel to deliver multiple and ultra-dilute chemicals for enhanced defect removal.
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Jun 01, 2007 at 01:53 PM |
 After a year-long evaluation period, STMicroelectronics has selected Clear Shape Technologies' ‘InShape' and ‘OutPerform' DFM products for 65nm and below device tapouts.
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May 24, 2007 at 04:48 PM |
 Brion Technologies, an ASML company, has said that it is collaborating with 11 member companies of the Japanese Semiconductor Technology Academic Research Center (STARC) to develop and test a complete DFM workflow solution for 65nm devices planned for production.
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May 24, 2007 at 04:40 PM |
 SEMATECH has undertaken a detailed competitive evaluation program to identify a best in class technology for advanced pattern placement metrology needs with the result that Carl Zeiss SMT has been selected to supply the R&D organization with the required tools.
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May 02, 2007 at 05:32 PM |
 International SEMATECH North has allocated $700,000 to fund research into novel photoresists for double patterning applications at the 32nm node and beyond. The work is being undertaken with the College of Nanoscale Science and Engineering ("CNSE") of the University at Albany and Columbia University.
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Apr 23, 2007 at 02:40 PM |
 SEMATECH has provided Veeco Instruments with a further $2.4 million in funding for the development of its Ion Beam Deposition Tool, which is being used in the fabrication of EUV mask blanks at the Albany R&D centre. Veeco has received approximately $19 million in funding for Ion Beam products and R&D programs, according to the company.
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Apr 19, 2007 at 06:07 PM |
 ASML Chairman, President and CEO Eric Meurice said in a conference call with financial analysts that the leading-edge semiconductor manufacturers would need to adopt doubling patterning using immersion 193nm ArF lithography tools, as EUV was not expected to ramp in production before 2010 (32nm node).
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Apr 18, 2007 at 04:28 PM |
 Synopsys and NanoGeometry Research have said that they are collaborating on faster, more accurate, optical proximity correction (OPC) modeling for 45nm designs that is intended to improve "manufacturing aware" OPC and reticle enhancement technology (RET) lithography simulation models.
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Lithography 
