Carl Zeiss SMT has been nominated for the German Future Prize – the Prize of the German President for Technology and Innovation. The team responsible for the nomination came from its EUV lithography group developing the complex mirrors required for the technology to be accepted into volume semiconductor manufacturing. The award is regarded as one of the most renowned in Germany in the field of technology and innovation. 

A major Korean chip manufacturer has selected Gigaphoton’s GT61A argon fluoride (ArF) excimer laser light source that will be used in high-volume production by the end of this year, according to the supplier. The GT61A is designed for immersion lithography tools. 

Takumi Technology has said that Chartered Semiconductor is working to validate Takumi's design-for-manufacturing (DFM) optimization software for process implementation of Common Platform technology for the 65nm node and preparing qualification at the 45nm node. 

MAPPER Lithography has claimed that an important milestone has been reached in its development of e-beam lithography tools with the demonstration of massively parallel writing capability. 

Air Products has agreed to sell its ‘OptiYield’ Positive Photoresist developer business to FUJIFILM Electronic Materials for an undisclosed sum. FUJIFILM said it would work closely with Air Products and customers to transfer supply and support functions from the Air Products' facility in Tempe, Arizona to Fujifilm's manufacturing and research operations in Mesa, Arizona. They expect the transfer to be completed in first quarter of 2008. 

ASML has said that its TWINSCAN XT:400F i-Line scanner recently reached a new productivity record by processing 150 (300mm) wafers per hour for 24 hours, reaching a new record output of 3,596 wafers in a single day. 

Rohm and Haas Electronics Materials has purchased SUSS MicroTec’s new Gamma XPress coat/develop cluster system, the first company to buy the new system. The Gamma XPress will be used by Rohm and Haas Electronic Materials to develop, characterize and optimize photodielectrics and both thick and thin photoresists.