NEC Electronics has placed a significant order for Brion’s Tachyon OPC+ optical proximity correction (OPC) product that will be used for 40nm designs. NEC had previously used Brion’s Tachyon RDI lithography simulation and design inspection system for 65nm designs. 

Wireless silicon technology provider CSR has announced that it has selected Ponte Solutions’ YA System for performing DFM analysis on the company’s semiconductor designs, thereby aiding in CSR’s move to 65nm processes. 

The aggressive node migrations seen at NAND flash memory manufacturers as they attempt to reduce production costs to keep pace with falling ASPs has been a boon for lithography tool suppliers ASML and Nikon with respect to increasing adoption of immersion lithography technology at the sub-60nm nodes. 

Silicon Integration Initiative (Si2) has announced that five new members have joined the Si2 ranks to strengthen the coalition’s aim to ensure the adherence of the IC manufacturing process to the original intended design of the IC. 

Cymer has said that it demonstrated new burst peak power figures for its laser produced plasma (LPP) system using a multi-staged carbon dioxide (CO₂) laser and tin (Sn) droplet target. At the recently held 2007 International EUVL Symposium in Sapporo, Japan, Cymer reached its initial goal of demonstrating 100 watts of extreme ultraviolet (EUV) burst power. 

Nikon Corporation has said that its volume production immersion tool - the NSR-S610C - has gained new customer wins in 2007 after the successful adoption and ramp of 56nm NAND flash, believed to be with long-standing customer Toshiba Corp. 

ASML has said that it believes the semiconductor lithography market could reach approximately $14.5 billion by 2012 with it taking a 50 percent share with revenues close to $7.2 billion by that year. The projection was made at an investor conference in London, England. 

An Asian-based customer has placed a repeat order with Micronic Laser Systems for an advanced Omega series laser pattern generator for photomask making for semiconductor applications. The system is scheduled for delivery in December 2007.