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Mar 10, 2006 at 04:37 PM |
In ASML's new annual report for 2005 the company noted to investors
that one customer that year had spent 609 million Euros on lithography
tools with the company making up 24 percent of net sales!Write Comment (0 comments) |
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Mar 01, 2006 at 02:34 PM |
UMC announced its 'design for manufacturing' (DFM), yield optimisation package for customers developing 90nm systems on chip (SoCs), incorporating DFM elements into standard-cell libraries, SPICE models and design flows. This is designed to provide users with yield-enhancing knowledge throughout design and manufacturing.
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Mar 01, 2006 at 09:30 AM |
A Major Asian IC Manufacturer has placed its first order
with Micronic Laser Systems for a Sigma7500 mask writing tool, Micronic's most
advanced production system.Write Comment (0 comments) |
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Feb 22, 2006 at 05:27 PM |
ASML presented images down to 42nm at the SPIE Microlithography meeting in San Jose, California. The 42nm dense lines, 84nm pitch patterns were printed on the ASML TWINSCAN XT:1700i system. Depth of focus was 1micron and the field size 26x33mm. In addition, ASML presented proof-of-concept 35nm images from its Extreme Ultra Violet (EUV) Alpha-Demo Tool (ADT). Write Comment (0 comments) |
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Feb 22, 2006 at 02:04 PM |
World-leading foundry TSMC claims that its immersion lithography is nearly production ready and that this has been achieved with proprietary techniques that produce near-zero defect rates. The company's immersion lithography programme has produced test wafers well within acceptable parameters for volume manufacturing, it adds. TSMC researchers will present their results at the SPIE Microlithography Conference in San Jose, California.Write Comment (0 comments) |
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Feb 22, 2006 at 10:25 AM |
Cymer will provide details of its lithography light source spectra to be incorporated into KLA-Tencor's PROLITH lithography optimisation tool. In addition, the companies expect to continue to jointly develop enhancements to this capability for future PROLITH revisions. Write Comment (0 comments) |
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Feb 21, 2006 at 04:41 PM |
Brion Technologies introduced Tachyon OPC+ aimed at accurate and predictable optical proximity correction (OPC) features on sub-65nm device designs without sacrificing speed or cost of ownership. Brion already supplies OPC modelling and verification technologies. Tachyon OPC+ now supplies implementation as well and is currently in beta evaluation and production flow integration at Brion's existing customer base. Write Comment (0 comments) |
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Feb 20, 2006 at 01:59 PM |
IBM scientists claim the smallest, high-quality line patterns ever made using deep-ultraviolet (DUV, 193nm) optical lithography - immersion-style, of course, but with a high index liquid rather than water. The distinct, uniformly-spaced 29.9nm ridges beat the one-time industry consensus limit for optical litho of 32nm, after which some other technology such as extreme ultraviolet (EUV, 13nm) radiation would have to be introduced and qualified. Write Comment (0 comments) |
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Feb 16, 2006 at 05:27 PM |
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Mentor
Graphics has stated that multiple integrated device manufacturers (IDMs) have
qualified its "Calibre MDP," software that compresses mask data files for all
types of mask writing tools to speed up writing times. It supports all mask
writer formats: MEBES, JEOL, Toshiba/NuFlare, Hitachi and Micronic. Write Comment (0 comments) |
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Feb 16, 2006 at 03:50 PM |
A major semiconductor IC manufacturer has received delivery of Nikon's first production ready immersion lithography tool, the NSR-S609B with a hyper-NA projection lens of NA 1.07. It has been widely known for some time that Toshiba would be the first customer to receive the tool as part of its plans to continue to aggressively scale its NAND Flash devices. The tool is expected to enter production in 2007.Write Comment (0 comments) |
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