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Sep 19, 2006 at 03:09 PM |
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SEMATECH, together with its subsidiary, the International SEMATECH Manufacturing Initiative (ISMI), has selected ASML MaskTools to qualify the imaging performance of advanced logic patterns, metrology structures and defect designs for the 45nm through to the 22nm node. This will be done using ASML's TWINSCAN XT:1700i immersion scanner at the company's demo lab facility in Veldhoven, Netherlands. Write Comment (0 comments) |
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Sep 19, 2006 at 02:52 PM |
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Taiwan Semiconductor Manufacturing Company (TSMC) has chosen to use Timbre Technologies' (a Tokyo Electron subsidiary) Optical Digital Profilometry - Mask (ODP-M) CD and profile metrology technology for development of advanced 32nm phase-shift masks at its captive mask shop in Taiwan. The technology is being used in conjunction with the Atlas-M Advanced CD and thin-film tool from Nanometrics, the company stated. Write Comment (0 comments) |
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Sep 19, 2006 at 01:14 PM |
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Matsushita Electric Industrial Co has selected
Mentor Graphics' ‘Calibre' OPCverify tool for RET verification of masks used
for production at the 65nm node. "Verification of post-OPC output is
critical to minimizing mask respins of million dollar mask sets, and avoiding
time-to-market delays," said Hiroyuki Tsujikawa, Semiconductor Company,
Matsushita Electric Industrial Co., Ltd. Write Comment (0 comments) |
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Sep 15, 2006 at 11:38 AM |
Fujitsu Limited and Advantest Corporation are planning to form a Joint Venture prototype foundry shuttle service that will initially offer 65nm processes from Fujitsu and use Electron Beam Direct Write (EBDW) lithography developed and manufactured by Advantest in the second quarter of 2007.Write Comment (0 comments) |
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Sep 06, 2006 at 02:06 PM |
Within the European Commission funded research project ‘More Moore' that is looking at a range of EUVL challenges a small team of scientist from Focus GmbH and two German universities, Bielefeld and Mainz have announced that they have been able to identify buried defects as small as 50nm under the multilayer coating of an EUV mask blank. Write Comment (0 comments) |
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Sep 06, 2006 at 12:59 PM |
ASML has announced that orders from both NAND Flash and DRAM chip manufacturers in the current quarter have significantly boosted the lithography tool supplier's unit bookings for its 3Q06 financial quarter than previously guided. ASML expects orders to come in at around 93 units, similar to the Q2 order intake level that had also been revised upwards from previous guidance. Write Comment (0 comments) |
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Aug 30, 2006 at 02:06 PM |
Two major R&D facilities, CNSE's Albany NanoTech in New York State and IMEC of Belgium have received delivery of the first two first ‘full field' EUV lithography systems designed and built by ASML.Write Comment (0 comments) |
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Aug 23, 2006 at 01:06 PM |
X-FAB Semiconductor Foundries AG is implementing Cadence Design Systems' Virtuoso NeoCircuit DFM solution to identify and eliminate yield-related problems early in the design phase and fabrication process of its analog and mixed-signal IP cores, according to the company.Write Comment (0 comments) |
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Aug 17, 2006 at 04:47 PM |
Obducat AB has announced that it has received notification from the US Patent Office that it will be issued with a new patent for its nano imprint lithography processes concerning non-stick and particle repelling coating materials.Write Comment (0 comments) |
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Aug 16, 2006 at 06:10 PM |
Synopsys has confirmed that it has acquired lithography modeling specialist SIGMA-C in a $20.5 million all cash transaction. The acquisition is intended to boost Synopsys Design for Manufacturing (DFM) software portfolio while enabling closer modeling to actual manufacturing layouts of critical lithography steps.Write Comment (0 comments) |
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