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Wafer Processing Product Briefs
Metal film thickness and composition measurement Print E-mail
Feb 04, 2005 at 04:00 PM
Product Briefing Outline: Thermo Electron Corporation has announced the release of its latest X-ray fluorescence instrument for semiconductor metrology, the "MicroXR" microbeam XRF platform. Designed for on-line and nearline measurements on semiconductor wafers, optical devices, high-density chip-scale packaging and substrate applications, the MicroXR presents particular benefits for the semiconductor and microelectronics markets.

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Consistant copper control Print E-mail
Feb 04, 2005 at 03:00 PM
ImageProduct Briefing Outline: ECI Technology
has announced the launch of its "QUALI-LINE QLC-8500" system. The QLC-8500 is an online chemical monitoring system for electroless baths used in VLSI damascene Cobalt capping applications. In addition to the proven CVS and Titration techniques, the QLC-8500 adds Spectroscopy, Oxidation Reduction Potential (ORP), Particle Count and many other critical capabilities to analyze and control electroless deposition. Multiple orders have already been booked, according to the company.





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Chamber design eliminates backside polymers Print E-mail
Feb 04, 2005 at 02:00 PM
ImageProduct Briefing Outline: Tokyo Electron (TEL) has announced a significant improvement in the design of their SCCM (Super Capacitively Coupled Module) chamber. The focus ring and supporting parts have been redesigned to greatly reduce and possibly eliminate the deposition of backside polymer at the wafer edge and bottom.
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