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Nov 15, 2005 at 05:42 PM |
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Product Briefing Outline: sp3 Diamond Technologies, Inc has introduced its sp3 Model 250 Hot Filament CVD Reactor. The Model 250 is designed for deposition of high-quality diamond films on various substrates in research organizations. A low cost platform, the Model 250 allows an educational R&D facility to utilize its own process control systems to develop wide area CVD diamond coatings, according to the company.Write Comment (0 comments) |
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Nov 08, 2005 at 04:05 PM |
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Product Briefing Outline: Accent Optical Technologies has expanded its FTIR application suite with the introduction of "Filmz". It employs new proprietary intelligent algorithms to extract the maximum amount of information from the measured IR spectrum, according to the company. The company claims that by directly integrating an interpretive engine within the algorithms dramatically improves the ease of use to the point whereby operators can generate effective recipes.Write Comment (0 comments) |
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Sep 27, 2005 at 09:13 PM |
 Product Briefing Outline: Olympus Integrated
Technologies America's (Olympus-ITA) new AL Series optical inspection
and defect review system delivers wafer edge and bevel inspection.
Olympus' full bevel inspection will allow the user to see the top,
side, and bottom of the wafer from various angles using a continuous
angle
adjustment for best imaging and defect detection.
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Sep 27, 2005 at 09:08 PM |
 Product Briefing Outline: Novellus Systems, has announced the introduction
of ‘INOVA NExT,' a 300mm metallization system for copper barrier/seed
applications at 45nm node and beyond. An extension of Novellus' INOVA
platform, the INOVA NExT features advanced physical vapor deposition
(PVD) technology, ion-induced atomic layer deposition (iALD), and a
wide array of manufacturability innovations.
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Sep 27, 2005 at 08:59 PM |
 Product Briefing Outline: KLA-Tencor has launched its
new Puma 9000 patterned wafer inspection platform-the first in a suite
of next generation inspection solutions. Developed in close
collaboration with customers to address the new defect and yield
challenges emerging at the 65nm and 45nm nodes, the Puma 9000 combines
a highly modular and extendible architecture with KLA-Tencor's ‘Streak'
imaging technology to enable the highest possible capture of critical
defects at production throughputs, according to the company.Write Comment (0 comments) |
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Sep 27, 2005 at 07:51 PM |
 Product Briefing Outline: Bede has launched
the latest variant of the "BedeMetrix" F X-ray metrology tool, which
delivers non-destructive, high speed film thickness measurement on
patterned wafers through combined XRR (X-ray Reflectivity) and XRF
(X-ray Flourescence). The result is an extended thickness measurement
range
of 1 nm to 10 μm on a wide range of material types. Proprietary small
spot X-ray optics enable measurement on test pads and in scribe lines
down to 100 μm for XRR and 30 μm for XRF, for in-line measurement on
product wafers.
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Sep 27, 2005 at 07:33 PM |
 Product Briefing Outline: Applied Materials has
unveiled the ‘Applied Producer Black Diamond II' system for
depositing the advanced low-k film. Providing a k-value of
less than 2.5, the Black Diamond II system utilizes Applied's
‘NanoCure' UV(1) curing technology to achieve a robust,
manufacturable film compatible with CMP(1) and packaging
processes. According to the company, Black Diamond II
enables the continued scaling of copper/lowk interconnects
to 45nm and beyond.Write Comment (0 comments) |
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Feb 04, 2005 at 11:00 PM |
 Product Briefing Outline: Varian Semiconductor Equipment
Associates, has launched a single wafer VIISta 810XE medium current
ion implanter. Based on the VIISta 810EHP, the VIISta 810XE is
designed to deliver the highest productivity and process performance. Multiple
orders for the VIISta 810XE have already been received. The initial shipments
will go to a DRAM manufacturer in Taiwan, according to the company.Write Comment (0 comments) |
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Feb 04, 2005 at 10:00 PM |
 Product Briefing Outline: KLA-Tencor has unveiled the
SpectraFx 200, its most advanced, seventh-generation thin-film
metrology system. It is designed to achieve cost-effective production
control over advanced film processes at the 65nm node and below. Based
on its spectroscopic ellipsometry (SE) technology, SpectraFx 200
leverages a new 150 SE option to enable qualification and monitoring of
such advanced films as ultra-thin ONO layers, nitrided films, high-k
and low-k dielectrics, amongst others.
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Feb 04, 2005 at 09:00 PM |
 Product Briefing Outline: Novellus Systems, has
launched "ALTUS DirectFill" - a single-system solution designed to meet
contact and via-fill needs at 65 nm and below. DirectFill eliminates
the need for conventional titanium/titanium nitride (Ti/TiN) toolsets.
This advanced plug-fill technique can reduce contact resistance (Rc)
and lower overall cost of ownership (CoO) by 50 percent or more when
compared to existing processes, the company claims.
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Wafer Processing 
