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Apr 18, 2006 at 05:14 PM |
 Product Briefing Outline: Bede X-ray Metrology, has announce the launch of a new Wafer Edge Defect Inspection capability using its patented ‘BedeScan' defect inspection system. The system is designed to look at process induced defects on the surface of the wafer, but crucially it can also detect crystallographic abnormalities inside the wafer which can lead to wafer breakage, and, therefore, problems with device yield, according to the company.Write Comment (0 comments) |
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Mar 30, 2006 at 12:48 PM |
 Product Briefing Outline: Rudolph Technologies, has launched the ‘E25' Wafer Edge Inspection System, a second generation replacement for August Technology's E20 System and the latest addition to its suite of "all-surface" inspection tools.Write Comment (0 comments) |
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Mar 09, 2006 at 04:31 PM |
 Product Briefing Outline: KLA- Tencor has launched its fifth-generation broadband UV/visible brightfield inspection system. The 2367 is claimed to deliver increased sensitivity and a 2x faster data rate to help chipmakers sample more frequently and capture critical layer defects earlier. The system is designed to work with KLA-Tencor's 2800 Series full-spectrum DUV/UV/visible brightfield inspection platform, the 2367 enables a mix-and-match inspection strategy that is claimed to provide the lowest overall cost of inspection for next-generation IC manufacturing. According to the company the 2367 is running in production at several 90-nm and 65-nm fabs worldwide.
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Feb 17, 2006 at 03:20 PM |
 Product Briefing Outline: KLA-Tencor has unveiled the Viper 2435 automated dispositioning system. The Viper 2435 is designed to capture the broadest range of critical defects while filtering out nuisance, enabling it to deliver quick go/no-go indicators that allow chipmakers to take corrective action before excursions become costly yield problems. Designed to provide high dispositioning accuracy at high throughput, the company claims a 67 percent lower cost of ownership than manual inspection alternatives.
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Feb 06, 2006 at 09:45 AM |
 Outline: KLA-Tencor has introduced the eS32 e-beam inspection
platform. The eS32 enables the industry's widest capture of subtle
electrical and small physical defects, which are arising as chipmakers
integrate numerous new materials and device architectures into volume
production. In addition to providing a proven BEOL solution, the eS32
offers the wide range of imaging conditions required to capture the
growing number of yield-limiting FEOL defect types. Volume shipments of
the eS32 are underway, according to the company.Write Comment (0 comments) |
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Jan 25, 2006 at 09:40 PM |
 Product Briefing Outline: Coventor, Inc. has introduced SEMulator3D, a computer-aided design (CAD) tool that provides silicon-accurate 3-D models of the devices and chips fabricated with semiconductor processing equipment, specifically produced within a given fab. This, the company believes will facilitate communication among fab personnel and to make employee training more productive. SEMulator3D also enables users to document and certify a wafer fab's manufacturing process, and any modifications, so the process can be transferred among a company's different wafer fabs, or between fabless chipmakers and foundries. Write Comment (0 comments) |
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Jan 10, 2006 at 06:16 PM |
 Product Briefing
Outline: A new, non-destructive,
nanotechnology weight metrology tool has been introduced by Metryx to handle
high volume production of 300mm semiconductor wafers. The Metryx Mentor DF3 has
also been designed to easily adapt to handling a mixed wafer fab environment
where 200mm and 300mm wafers are continually interchanged.
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Dec 22, 2005 at 03:36 PM |
 Product Briefing Outline: n&k Technology, has launched its
next-generation photomask system that combines the capabilities of a CD-SEM, a
DUV dual-beam laser-interferometer, and a spectroscopic ellipsometer into a
single unit.
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Dec 15, 2005 at 04:59 PM |
 Product Briefing Outline: Jordan Valley Semiconductors has launched the "JVX 6200" metrology tool platform. The new platform combines second generation X-ray Reflectivity (XRR), improved micro-spot X-ray Fluorescence (XRF), and industry leading Small Angle X-ray Scattering (SAXS), according to the company.Write Comment (0 comments) |
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Dec 14, 2005 at 07:05 PM |
 Product Briefing
Outline: Novellus Systems, has introduced SOLA, the industry's first
standalone ultraviolet thermal processing (UVTP) system targeted at the
post-deposition processing of advanced dielectric films. Designed for
high-volume manufacturing at 300mm, SOLA addresses the requirements for new
materials and manufacturing technologies necessitated by the next generation of
consumer electronic products.Write Comment (0 comments) |
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Wafer Processing 
