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Aug 29, 2006 at 06:11 PM |
 Product Briefing Outline: ULVAC Technologies has launched the Enviro ‘Optima' Resist Strip System that the company claims has the smallest 300mm resist strip system footprint and thus provides the highest throughput per square meter of cleanroom space at the lowest cost.
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Aug 29, 2006 at 03:22 PM |
 Product Briefing Outline: Nova Measuring Instruments has launched the next generation of its NovaScan metrology systems, the ‘NovaScan 3090Next' series. The stand-alone metrology system provides improved topography modeling, faster throughput and excellent matching between tools and fabs, according to the company. This is done through implementation of polarized normal-incidence spectroscopic scatterometry, with an extended ultraviolet and infrared spectral range, for measuring the thickness and topography of thin films widely used in semiconductor manufacturing.Write Comment (0 comments) |
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Aug 21, 2006 at 11:50 AM |
 Product Briefing Outline: Axcelis Technologies, has launched an Optima HD ion implanter, powered by ‘Imax,' for extremely high dose, low energy implant applications used for leading-edge memory and logic devices. The Optima HD Imax according to the company is designed to dramatically increase productivity and reduce low energy, high dose process times by implanting clusters of boron, instead of individual atoms. The first Imax-enabled Optima HD tools will begin shipping by the end of the 2006.Write Comment (0 comments) |
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Aug 21, 2006 at 11:24 AM |
 Product Briefing Outline: Carl Zeiss SMT's Nano Technology Systems division (Carl Zeiss NTS) and SII NanoTechnology Inc. (SIINT) have jointly introduced the XVision 300 Focused Ion Beam (FIB)/Scanning Electron Microscope (SEM) hybrid system. The XVision 300 is designed to enable ultra-high resolution, 3-dimensional surface and sub-surface process inspection and defect analysis on 300mm wafers at the 65/ 45nm node and beyond. The workstation, enables for dissection of high quality TEM lamellas from anywhere on a 300mm wafer. This is the first jointly developed product emerging out of the strategic alliance between the two respective companies earlier in 2006.Write Comment (0 comments) |
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Aug 17, 2006 at 05:11 PM |
 Product Briefing Outline: Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan has launched the Model AL3300 optical inspection and defect review system for full top, edge, bevel and back side inspection of 300 millimeter wafers.
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Aug 17, 2006 at 03:00 PM |
 Product Briefing Outline: Applied Materials has made a significant enhancement to its Applied ‘Endura CuBS' (copper barrier/seed) system with the new ‘Aktiv' Preclean chamber, extending its capabilities for the 45nm node copper-low k interconnect process schemes. In addition to effectively removing polymeric residues and copper oxide from the interconnect, the Aktiv Preclean chamber is claimed to be the first preclean technology that effectively preserves the integrity of ultra-low k (k less than or equal to 2.5) dielectrics, resulting in up to 10% improvement in RC delay over previous reactive preclean technologies.
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Aug 17, 2006 at 01:54 PM |
 Product Briefing Outline: Applied Materials has combined advances in PVD titanium (Ti) and preclean technologies within the Applied ‘Endura' iLB II, to reduce resistance in critical contact structures by up to 40%, according to the company. The system's new PVD eSIP chamber deposits a Ti layer with improved uniformity on the wafer, plus a claimed 30% greater bottom coverage over that of the previous system. In addition its ‘Siconi' Preclean chamber, an improved surface preparation technology for yield-critical transistor and contact interfaces, provides better removal of oxide from the contact bottom with minimal silicon loss.Write Comment (0 comments) |
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Aug 17, 2006 at 01:22 PM |
 Product Briefing Outline: Tokyo Electron Ltd. (TEL) has announced the release of the company's new Probing Accuracy Diagnosis System, TELPADS-O. Integrated with TEL's 300mm fully automatic wafer prober, the P-12XLm, the new system provides users with off-line, high speed probe mark inspection analysis.
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Aug 17, 2006 at 12:57 PM |
 Product Briefing Outline: Timbre Technologies, a TEL company, have launched the latest version of their Optical Digital Profilometry (ODP) technology, ODP 2006. The company has included a broad range of enhancements and expanded capabilities to improve scatterometry technology to control CD process conditions at the 65nm node. ODP 2006 is included as part of Timbre's maintenance plans and is standard for all new orders. It is also available to existing customers as an upgrade to their existing ODP systems.
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Jun 22, 2006 at 01:54 PM |
 Product Briefing Outline: Applied Materials, has launched ‘NeXus SPC' its next generation advanced process control software and hardware, used exclusively on a range of Applied's 300mm process tools. The new diagnostic tool performs split-second analysis of process conditions which is critical information that can increase system uptime and yield, protect wafers from process drift and enable more cost-effective maintenance schedules. Currently, Applied customers employ the NeXus platform on more than 350 of its process systems worldwide.Write Comment (0 comments) |
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Wafer Processing 
