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Jan 05, 2007 at 02:18 PM |
 Product Briefing Outline: Oxford Instruments has introduced its new TEOS delivery module for plasma-enhanced chemical vapour deposition (PECVD) of silicon dioxide (SiO2) in its ‘Plasmalab' range of deposition tools. TEOS offers an alternative PECVD precursor to the commonly-used silane for applications such as photonics and dielectric layers in which high quality, conformal deposition of SiO2 is required, according to the company. The company has already received its first order for a complete PlasmalabSystem133 TEOS system incorporating the new module from a prestigious Chinese institute.
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Nov 28, 2006 at 10:06 AM |
 Product Briefing Outline: The SEZ Group has launched the new ‘Esanti' platform targeting front-end-of-line (FEOL) cleaning and resist-stripping processes for 45nm and below. It builds on the company's core spin-processor technology, adding new capabilities that enhance defect removal and surface drying to effectively address a wide range of high-volume manufacturing applications. SEZ's proprietary Enhanced Sulfuric Acid ‘ESA' strip process is also optimized for deployment with the Esanti platform. SEZ reports that it has multiple Esanti systems in beta test with customers.
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Nov 24, 2006 at 04:01 PM |
 Product Briefing Outline: Rudolph Technologies, Inc. has released its new ‘Synergy MPX' System, which combines Rudolph's patented ‘PULSE Technology' with new monochromatic microspot x-ray fluorescence (MMXRF) technology on a single tool platform. This new addition offers a production-worthy technique to measure the ultrathin opaque films, such as ALD layers, that will be required for next-generation processes.
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Nov 21, 2006 at 04:22 PM |
 Product Briefing Outline: Varian Semiconductor Equipment Associates, Inc. has introduced VIISta ‘SuperScan,' which provides a method of using VIISta medium & high current implanters to compensate for non-uniformity of device electrical characteristics resulting from other semiconductor process steps. SuperScan provides customers with the capability to correct Vt non-uniformity by using ion implantation to compensate for gate length critical dimension (CD) variations. Vt, or threshold voltage, one of the most critical transistor characteristics in device manufacturing, directly impacts chip speed and power consumption. The system is available as an option on the VIISta platform and as an upgrade on installed systems.
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Nov 20, 2006 at 06:35 PM |
 Product Briefing Outline: SensArray Corporation has introduced the ‘Integral Wafer,' which is designed to collect insitu process information for certain critical, harsh environment process applications that would not otherwise be possible. Integral Wafer has already been delivered to leading-edge semiconductor manufacturers and semiconductor equipment OEMs.Write Comment (0 comments) |
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Nov 20, 2006 at 05:26 PM |
 Product Briefing Outline: FSI International has introduced a new selective nitride etch process that suppresses oxide and silicon attack without generating high particle counts using its ‘MAGELLAN' Immersion Cleaning System. These applications were developed on customer wafers as part of a 45nm advanced technology program and would also be useful for older technology generations, according to the company.
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Nov 14, 2006 at 02:01 PM |
 Product Briefing Outline: Applied Materials has introduced the ‘Applied Producer GT,' which it boldly claims is the industry's fastest, most cost-effective CVD1 platform. The Producer GT is said to be capable of processing 150 wafers per hour (wph), which doubles the throughput of any competitive system, and enables a 30% reduction in cost of ownership and a 50% increase in wph/m2 footprint, according to the company. The Producer GT supports the full portfolio of Applied's PECVD1 technology applications with more than 30 production-proven processes.
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Oct 04, 2006 at 05:45 PM |
 Product Briefing Outline: Tokyo Electron (TEL) has introduced the company's latest 300mm metal CVD (chemical vapor deposition) system ‘Trias' LT Ti/TiN. The new system enables deposition of Ti (Titanium) and TiN (Titanium Nitride) films in low
temperature process regimes. Based on the industry-proven Trias platform, the Trias LT Ti/TiN meets the increasing demands for low temperature processing required
in the manufacture of nickel silicide contacts, without the need to migrate to alternative technologies.
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Oct 03, 2006 at 04:41 PM |
 Product Briefing Outline: Mattson Technology has entered the growing rapid thermal oxidation (RTO) market with the launch of ‘Atmos,' based on the Helios RTP platform. Atmos is a dual-chamber, single-wafer 300mm RTP system for high-volume chip manufacturing through the 32nm technology node. Atmos enables a broad range of RTO applications, including selective oxidation and shallow-trench isolation. The thermal oxidation market segment is forecasted (Gartner) to be $112.4 million in 2006, with a compound annual growth rate of 25.9 percent from 2005 to 2011. Mattson has already received multiple orders for the new system and recently shipped the Atmos to a leading integrated device manufacturer for qualification at the 70nm node and below.
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Sep 25, 2006 at 01:59 PM |
 Product Briefing Outline: Novellus Systems has launched its newest line of ‘GAMMA Express' dry photoresist dry strip high dose implant strip (HDIS) systems for 300mm wafer processing. A single product platform for both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications, GAMMA Express is claimed to provide the highest levels of technology, reliability and productivity for bulk strip and HDIS at the 65nm and 45nm nodes. The system is currently in beta evaluation with a large memory manufacturer in Asia, according to the company.
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Wafer Processing 
