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Jun 28, 2007 at 05:10 PM |
 Product Briefing Outline: Novellus Systems has introduced a new patent-pending ashable hard mask (AHM) process technology on the ‘VECTOR Express' plasma-enhanced chemical vapor deposition (PECVD) platform. The technology has been designed to address the challenges in advanced technology nodes that utilize 193nm lithography for high aspect patterning etch, where thinning photoresist material makes it difficult to extend conventional patterning. Novellus has already delivered tools with this new capability to major memory manufacturers.
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Jun 28, 2007 at 12:42 PM |
 Product Briefing Outline: KLA-Tencor launched its latest range of tools to the 28xx brightfield inspection platform, featuring specialized optical configurations intended to solve the unique defect detection challenges of sub-55nm memory and sub-45nm logic chips. Both the 2810 system for memory devices and the 2815 system for logic use the full-spectrum illumination technology that is designed to capture the broadest possible range of defect types, including yield-critical immersion lithography defects. The system's production throughput at sensitivity has more than doubled for many applications, compared to the previous 2800 system.
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Jun 25, 2007 at 02:46 PM |
_100.jpg "Image") Product Briefing Outline: Lam Research has launched the 2300 Motif post-lithography pattern enhancement system that uses a proprietary plasma-assisted process. The new system delivers controlled photoresist hole and space CD shrinks of up to 100nm, creating features as small as 10nm, demonstrating extendibility to the 22nm node and beyond. According to the company, competitive post-lithography pattern enhancement systems are typically limited to shrinks of less than 30nm. The system was developed in collaboration with IMEC.
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Jun 19, 2007 at 02:24 PM |
 Product Briefing Outline: FEI has launched the V600CE - a new member of its V600 focused ion beam (FIB) family of circuit edit tools. The V600CE is claimed to enable faster semiconductor design validation and performance optimization on today's 65nm-and-below devices due to its advanced ion column technology, versatile gas delivery system, and advanced end-pointing control.
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Jun 19, 2007 at 12:49 PM |
 Product Briefing Outline: KLA-Tencor has revealed its latest advancement in darkfield patterned wafer inspection technology in the Puma 9150 system. The tool features new optical modes that enable capture of a broader range of yield-critical defects for 45nm production while providing the highest available darkfield production throughputs, reducing operating cost and allowing higher sampling rates for tighter process control, according to the company. KLA-Tencor has shipped Puma 9150 systems to memory and logic customers in all chipmaking regions, including multiple systems to several fabs. The system is being used for 65nm production, 45nm ramp, and sub-45nm R&D.
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Jun 14, 2007 at 11:06 AM |
 Product Briefing Outline: FEI Company has launched its next-generation tool in the product family, the DualBeam Expida 1255S system, which is claimed to be the first and only wafer DualBeam system to integrate wafer level STEM (scanning/transmission electron microscopy) sample preparation with ultra-high-resolution imaging and analysis in a single tool. The Expida 1255S features an advanced ion beam column for preparing TEM samples, and an enhanced electron column with a 14-segment STEM detector for high-resolution 30kV imaging to support advanced manufacturing process at the 45nm node and beyond.
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Jun 05, 2007 at 12:43 PM |
 Product Briefing Outline: FEI has introduced a Remote Access Program for Interactive Diagnostics (RAPID) via its customer service organization that is designed to improve service support times and optimize tool uptime. The RAPID program is first being made available to FEI customers in North America and will soon be extended worldwide, according to the company.
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Jun 04, 2007 at 02:17 PM |
 Product Briefing Outline: Applied Materials has introduced the ‘Applied Producer BLOk' II PECVD, a new system designed for advanced barrier low-k technology at the 45nm node and for use in 32nm R&D. Used in conjunction with Black Diamond (R) low-k films, the BLOk II barrier film is claimed to reduce the effective k-value of the interconnect dielectric stack by up to 10%. A critical in situ pre-clean treatment provides a 30% higher electromigration resistance than competing barrier technologies, according to the company.
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May 17, 2007 at 12:24 PM |
 Product Briefing Outline: PDF Solutions has launched its new yield analysis software aimed at the IC Memory market. The Memory Yield Enhancement solution is based on PDF Solutions' tools, methods, and services that are designed to accelerate yield ramps and optimize mature yields. PDF Solutions said that is has successfully deployed the Memory Yield Enhancement solution at Elpida Memory Inc., a leading Japanese DRAM manufacturer. The continuing engagement, which began in 2006, covers two advanced DRAM process nodes at Elpida's fab in Hiroshima Japan and includes optimizing yield learning during both ramp and mass production.
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May 15, 2007 at 03:20 PM |
 Product Briefing Outline: Applied Materials has launched the ‘Applied Producer Celera' PECVD system, which is designed to handle advanced strain engineering technologies for enabling faster transistors in 45nm-and-beyond devices. The Producer Celera enables improved transistor drive current by applying a uniaxial stress in the device channel.
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Wafer Processing 
