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Nov 02, 2007 at 03:21 PM |
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 Product Briefing Outline: FEI Company has introduced the ‘Titan3’ 80-300 to its Titan product family. The Titan3 takes the capabilities of FEI's Titan S/TEM microscope to new levels of performance and enhanced operation, according to the company. This gives users both the sub-Angstrom imaging capabilities and a lower total cost of ownership for a high-end microscope.
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Oct 18, 2007 at 04:02 PM |
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 Product Briefing Outline: Surfect Technologies has launched two new development electroplating tool versions that leverage its Ascent 200mm and Leapfrog 300mm scalable plating tool platforms. These new development tools are designed to enable more companies to enter and support the growing market for wafer level packaging by providing the basic metal deposition engines along with control and chemical delivery systems.
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Oct 04, 2007 at 10:49 AM |
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 Product Briefing Outline: Tokyo Electron (TEL) has said that starting October 1, 2007, the company will begin receiving orders for the ‘Trias’ High-k CVD system. The new system is a 300mm single-wafer cluster tool designed to produce thin-film materials required for the advanced gate stack, which will be incorporated in the most advanced semiconductor devices at the 45nm node and beyond, according to the company.
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Sep 06, 2007 at 04:45 PM |
 Product Briefing Outline: Advanced Metrology Systems (AMS) has launched the IR 3100S small spot MBIR (Model Based Infra-red Reflectometer) system. The IR 3100S is a highly automated, online measurement system that uses proprietary mid-IR optics. The 70 by 70 micron spot size targets 3D etched structures such as DRAM straight and bottle-shaped trenches, recess measurements along with stacked DRAM contact capacitor profiling and composition measurements.
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Sep 06, 2007 at 04:31 PM |
 Product Briefing Outline: Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in high-performance process control metrology, defect inspection and data analysis for the semiconductor manufacturing industry, today announced the rollout of its new ‘Explorer' Inspection Cluster—a family of multi-surface inspection tools designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership.
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Sep 06, 2007 at 11:19 AM |
 Product Briefing Outline: Advanced Metrology Systems (AMS) has introduced the IR3100N, a model-based infrared (MBIR) reflectance metrology solution for measuring 3D structures. The new IR3100N includes proprietary optics and an extended near infrared (NIR) measurement designed for highly automated measurements of product wafers at the 70nm node and below. The new tool broadens AMS's product portfolio to handle the high volume measurements of next generation shallow silicon structures and interconnect layers.
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Aug 22, 2007 at 03:56 PM |
 Product Briefing Outline: Novellus Systems has introduced the VECTOR ‘Extreme' plasma enhanced chemical vapor deposition (PECVD) system that is one of the first systems designed to specifically tackle the high-throughput/short cycle time requirements of ‘Mega' fabs that have production capacity in excess of 100,000wspm. The VECTOR ‘Extreme' has a claimed throughput of up to 250 wafers per hour with the use of 12 deposition stations that also achieve cycle-time reductions of more than 40 percent as compared to other systems available in the market, according to the company.Write Comment (0 comments) |
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Aug 14, 2007 at 02:32 PM |
 Product Briefing Outline: KLA-Tencor has introduced SURFmonitor, a module that extends the Surfscan SP2 unpatterned surface inspection system beyond traditional defect inspection to also monitor process variation and drift. The SURFmonitor system is designed to measure variations in surface morphology of bare wafers or blanket films, which correlate to a broad array of process parameters such as surface roughness, grain size, and temperature. SURFmonitor, is claimed to create detailed, full-wafer parametric maps with sub-Angstrom repeatability in under a minute--while defect information is being collected--enabling fabs to monitor both process variability and defectivity simultaneously. It is also claimed to have the ability to detect atomic-level roughness variations that allows it to replace AFM's to a large extent.
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Jul 24, 2007 at 04:31 PM |
 Product Briefing Outline: Intevac has entered the semiconductor etch equipment market with its ground-up new ‘Lean Etch' high-volume dielectric etch platform. The new tool is claimed to be the first ever wafer processing system designed and built using ‘lean principles'. The Lean Etch system uses a novel parallel architecture utilizes two sets of twin linear robots to replace the large, central handler common to all cluster tools. This gives the system a minimal mainframe footprint and maximizes fab space efficiency, according to the company. The linear platform is intended to eliminate dependency on a single, central robot and offers improved uptime through availability redundancy. The high-speed transport system yields throughputs as high as 200wph, according to the company.Write Comment (0 comments) |
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Jul 24, 2007 at 03:27 PM |
 Product Briefing Outline: Applied Materials has launched its Applied Producer ‘ACE' SACVD system. The system is designed to extend 193nm lithography using self-aligned double patterning (SADP) schemes, Applied's ACE system is claimed to deliver a highly conformal oxide spacer film with >95 percent step coverage, <5 percent pattern loading and <1 percent non-uniformity, enabling state-of-the-art critical dimension control. Combined with a benchmark throughput of >80 wafers per hour and a low thermal budget, the ACE system extends spacer solutions for SADP to the 32nm node and beyond.
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Wafer Processing 
