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Feb 20, 2006 at 06:27 PM |
 Outline: Aprio Technologies has launched Halo-iOPC, the company's first product with features intended for both the design and manufacturing communities. Halo-iOPC, a superset of Aprio's optical proximity correction (OPC) product, is the first of its second-phase products that begin to enable better collaboration between design and manufacturing.Write Comment (0 comments) |
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Feb 17, 2006 at 03:57 PM |
 Product Briefing Outline: KLA-Tencor has launched its next-generation photomask inspection system, STARlight-2TM. The system is claimed to be the most cost-effective contamination inspection solution in the industry for all types of photomasks, including mainstream extreme resolution enhancement technique (XRET) photomasks, at the 65nm node and below. According to KLA-Tencor the use of a revolutionary image processing technology is at the heart of the systems performance. The system has been designed for the detection of progressive defects--an increasingly critical class of yield killers that impact device yield over time and can cause catastrophic device reliability problems.
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Feb 09, 2006 at 11:19 AM |
 Product Briefing Outline: Invarium, Inc has unveiled "DimensionPPC," which it claims to be the industry's first unified, full-chip Process and Proximity Compensation (PPC) product for patterning integrated circuit (IC) layouts at 65 nm and below. Architected from the ground up as a new-generation layout-to-mask solution, DimensionPPC is intended to overcome the deficiencies of today's RET/OPC tools and layout correction techniques for other process effects, from mask through etch. The product has been fab-validated at 65nm during the fourth quarter of 2005. The technology is currently in production deployment at one customer site and is being qualified for production use by five additional leading semiconductor manufacturers.Write Comment (0 comments) |
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Feb 08, 2006 at 06:28 PM |
Product Briefing Outline: KLA-Tencor has launched its latest-generation
optical CD metrology system, the SpectraCD-XT, which provides inline CD
and profile measurements of critical device structures that help enable
early prediction of IC performance and yield at the 90-nm and 65-nm
nodes. The only high-performance spectroscopic ellipsometry (SE)-based
CD metrology tool with sub-two-second move-acquire-measure (MAM) time,
SpectraCD-XT provides a two-fold increase in throughput (to more than
100 wph) compared to the previous-generation platform at comparable
performance, according to the company.
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Jan 09, 2006 at 05:33 PM |
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Product Briefing
Outline: Mentor Graphics
Corporation has launched the "Calibre OPCverify" tool, a new generation of OPC technology
and has expanded the design for manufacturing (DFM) solutions from Mentor. Calibre
OPCverify uses silicon-proven simulation models from Calibre OPCpro, providing
100% simulation coverage of the entire chip to ensure silicon-patterning
success, according to the company. Write Comment (0 comments) |
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Dec 09, 2005 at 02:15 PM |
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Product Briefing Outline: Gigaphoton Inc has launched the GT60A a 193 nm, 6,000 Hz repetition rate, 60 watt laser light source designed for immersion lithography tools patterning at the 45nm node.Write Comment (0 comments) |
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Oct 05, 2005 at 10:54 AM |
 Product Briefing Outline: KLA-Tencor has unveiled what it claims
to be the industry's first full-chip process window inspection system
for post-RET reticle design layout inspection. "DesignScan" is intended
to reduce the number of mask design respins needed to achieve a
high-yielding design, resulting in better parametric design performance
and faster time-to-market. DesignScan is especially suited for 90-nm
and below designs, where lithography process windows are extremely
small and problematic. Several leading integrated device manufactures
(IDMs), foundry, and fabless chipmakers are currently evaluating
DesignScan, according to the company.
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Oct 04, 2005 at 05:48 PM |
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Product Briefing Outline: Timbre Technologies, Inc., a TEL company, has
released its latest version of Optical Digital Profilometry - Mask
(ODP-M) metrology product, TeraGen-M 2.7. The system provides fast,
accurate and non-destructive profile metrology of advanced photomasks.Write Comment (0 comments) |
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Oct 04, 2005 at 04:19 PM |
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Product Briefing Outline: Brion Technologies has launched its
"Focus Exposure Modeling" (FEM) system, for one-model, full-chip, full
process window lithography simulation applications. FEM is designed to
simulate real-world lithography manufacturing processes before
photomask or wafer production begins. Write Comment (0 comments) |
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Oct 03, 2005 at 05:55 PM |
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Product Briefing
Outline:
Luminescent Technologies, has launched its "Inverse Lithography
Technology" (ILT) platform -- a completely new methodology for Resolution
Enhancement Technology (RET) software. Luminescent's first product is called
"Explorer," which combines sophisticated software and hardware to provide
complete ILT capability for small blocks ILT enables improved pattern fidelity,
expanded lithography process windows and reduced mask preparation cycle time,
according to the company. In an inverse approach to RET/OPC generation the new
technology first evaluates the desired on-wafer pattern and then mathematically
determines the mask features needed to produce the intended silicon outcome.
Wafer results from multiple semiconductor manufacturers have successfully
proven ILT's superior capabilities at 90nm, 65nm and 45nm nodes, according to
the company.Write Comment (0 comments) |
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Lithography 
